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Flip Chip Semiconductor Packaging Design
Jobs
No openings found right now · Updated daily
Active Flip Chip Semiconductor Packaging Design roles are indexed directly from company ATS systems — Greenhouse, Lever, Workday, Ashby, and 15+ others. Advertised salaries average $392k/year based on live listings. 26% of roles are remote-friendly. These listings don't come from other job boards — they're pulled from source, so many won't appear on LinkedIn, Indeed, or Glassdoor.
Open Roles
0
Avg Salary
$392k
Remote-Friendly
26%
Added This Week
22
Sectors Hiring Flip Chip Semiconductor Packaging Designs
Chip Design Engineer
Annapurna Labs Ltd.
Tel Aviv-Yafo, TA, ISR Onsite Direct
Chip Design Engineer
Annapurna Labs Ltd.
Tel Aviv-Yafo, Tel Aviv, ISR Onsite Mid Direct
Chip Design Student
Annapurna Labs Ltd.
Haifa, HA, ISR Onsite Entry Direct
Packaging Designer
Perry Ellis International
New York, New York, United States Hybrid Mid Direct
Junior QA Engineer (Flip Team)
eMAG
Headquarters Flip Entry Direct
Packaging Design Engineer
Signode
Brighton, MI, United States not-applicable Direct
Assoc Packaging Designer
Hasbro
P.R. China Onsite Junior Direct
Packaging Engineer
Hasbro
United States Direct
SoC Chip Architect, Google Cloud, Silicon
[Tel Aviv, Israel, [Yigal Alon St 98, Tel Aviv-Yafo, Israel], Tel Aviv-Yafo, null, Tel Aviv District, IL] Direct
Chip CAD DevOps Engineer, Google Cloud
[Sunnyvale, CA, USA, [111 W Java Dr, Sunnyvale, CA 94089, USA], Sunnyvale, 94089, CA, US] Direct
Packaging Technician Lead
Hurlock, MD Onsite Lead Direct
Sr. Physical Design Engineer - Full Chip, Hardware Compute Group
ADCI
Bengaluru, Karnataka, IND Onsite Senior Direct
Packaging executive - TL, IN-packaging
ASSPL
Bengaluru, Karnataka, IND Onsite Mid Direct
Structural Packaging Designer
Everstar
Kyiv | Київ, UA Direct
Medication Packaging Technician
Wedgewood Pharmacy
Swedesboro, NJ Onsite Direct
Design Engineer (Semiconductor Machinery Applications)
Freeform
El Segundo, California, United States Onsite Direct
Design Director (Branding & Packaging)
Landor
Mumbai, Maharashtra, India Hybrid Director Direct
Senior Commodity Analyst, Semiconductor and Passives
[Taipei, Taiwan, [110, Taiwan, Taipei City, Xinyi District, Ankang Village, Section 5, Xinyi Rd, 109號2樓], Ankang Village, 110, Taipei City, TW] Senior Direct
Packaging Executive, ROW Packaging Programs
Amazon Commercial Services
Johannesburg, Gauteng, ZAF Onsite Direct
Packaging Executive
Souq. com for E-Commerce LLC
Cairo, EGY Onsite Executive Direct
Chip Validation Software Engineer
Annapurna Labs Ltd.
Haifa, Haifa, ISR Onsite Mid Direct
Cannabis Packaging Technician
C3 Industries
St. Louis, MO Onsite Direct
Multidisciplinary Designer - Packaging & Brand Design
CoCreativ
Los Angeles, California, United States Hybrid Direct
Sr. SDE, Chip Validation Ops
Annapurna Labs
Cupertino, California, USA Onsite Senior Direct
Packaging Associate
ASSPL
Bengaluru, Karnataka, IND Onsite Entry Direct
Packaging Associate
ASSPL
Bengaluru, Karnataka, IND Onsite Entry Direct
Packaging Executive
ASSPL
Bengaluru, Karnataka, IND Onsite Executive Direct
Sr. Director, Pricing & Packaging
Smartsheet
United States Director Direct
Packaging and Sustainability Manager
Revance
Johnson City, TN, Remote Remote Manager Direct
Design Lead
Monograph
San Francisco, California, United States Remote Lead Direct
Technical Packaging Manager
THG
Manchester, England, United Kingdom Manager Direct
Packaging Associate
Story Cannabis
Hancock, MD Onsite Direct
Packaging Associate (FTC)
ASSPL
Bengaluru, Karnataka, IND Onsite Entry Direct
Sr. Packaging Development Specialist
Monster Energy
Corona, California, United States Onsite Senior Direct
Design Coordinator
HDR
Canada-Alberta-Calgary Onsite Direct
Design Coordinator
HDR
Canada-Alberta-Calgary Direct
Design Coordinator
HDR
Canada-Alberta-Calgary Onsite Direct
Design Coordinator
HDR
Canada-Alberta-Calgary Onsite Direct
Packaging Program Manager
Amazon Turkey Operasyon Hizmetleri Limited Sirketi
Istanbul, TUR Onsite Manager Direct
Packaging Specialist
Nivagen Pharmaceuticals
Pittsburg, California, United States Onsite Direct
Global Pricing & Packaging Manager
Halter
Auckland Manager Direct
Director, Pricing and Packaging
Gainsight
United States- Remote Remote Director Direct
Sr. Packaging Development Manager
Monster Energy
Corona, California, United States Onsite Manager Direct
Packager
Flowly Solutions
Palo Alto, CA Onsite Direct
Principal Packaging Eng
Amazon Development Center U.S., Inc.
Cupertino, California, USA Onsite Senior Direct
Associate Director, Technical Operations (Pharmaceutical Packaging)
US Remote Director Direct
Senior Design Manager
O2EPCM, Inc.
Los Angeles, California, United States Onsite Senior Direct
Photonics Design Engineer
Lightmatter
Boston, MA Hybrid Staff Direct
Senior Design Engineer
Newsela
Remote - FTE Remote Senior Direct
Director, Product Design
Givebutter
Remote Remote Director Direct
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Common Questions
- How many Flip Chip Semiconductor Packaging Design jobs are available?
- JobsGlitch lists active Flip Chip Semiconductor Packaging Design jobs sourced daily from Greenhouse, Lever, Ashby, Workday, and other top ATS platforms.
- What skills are required for Flip Chip Semiconductor Packaging Design roles?
- The most in-demand skills for Flip Chip Semiconductor Packaging Design roles are Data analysis, Process improvement, Packaging development, Packaging design, Regulatory compliance. Requirements vary by seniority and company.
- What is the average salary for a Flip Chip Semiconductor Packaging Design?
- The average salary for Flip Chip Semiconductor Packaging Design roles on JobsGlitch is approximately $392k/year. Compensation varies by location, seniority, and company.
- Are there remote Flip Chip Semiconductor Packaging Design jobs?
- Yes — 26% of Flip Chip Semiconductor Packaging Design jobs on JobsGlitch are remote-friendly. Browse remote Flip Chip Semiconductor Packaging Design jobs at jobsglitch.com/jobs/remote/flip-chip-semiconductor-packaging-design.