Amazon Development Center U.S., Inc.
Cloud Computing
PrincipalPackagingEng
“Principal Packaging Eng at Amazon Development Center U.S., Inc.. Skills: Mechanical Engineering, Thermal Engineering, System Design, SoC Thermal Modelling. Design and build systems. Develop circuit design”
What You'll Achieve.
Deliver world-class customer experience; Improve product performance; Improve product quality; Improve product cost
Industry & Context.
Troubleshooting; Debugging; Resolving issues
What They're Looking For.
Must Have
BS or MS degree, 10+ years industry experience, 3+ years SoC Thermal modelling, Experience with Chip package design, Collaborate effectively with teams, Work with ODMs and vendors
Nice to Have
Knowledge of SoC thermal/mechanical design, Programming experience: Bash, Shell, Linux, Python, Lua, Working knowledge on fans, valves, chillers, CDUs, Knowledge of heatsink solutions, Knowledge of TIMs and liquid cooling, Develop detailed CFD and compact RC models, Knowledge of hardware/software thermal control, Optimize thermal solutions under PPA, Simulate and prototype thermal control, Validate thermal models through measurements
What You'll Do.
Design and build systems
Develop circuit design
Develop large system design
Develop thermal solutions
Oversee high volume manufacturing
Design hardware for data centers
Optimize hardware design
Provide leadership in new technologies
Deliver world-class customer experience
Develop detailed specifications
Resolve issues across organization
Develop CFD and compact RC models
Optimize thermal solutions
Simulate thermal control strategies
Prototype thermal control strategies
Validate thermal models
How You'll Work.
Team & Collaboration
Collaborate with teams; Work with ODMs; Work with vendors; Cross-boundary triaging
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