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Director Semiconductor Ic Packaging Assembly Engineering
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Active Director Semiconductor Ic Packaging Assembly Engineering roles are indexed directly from company ATS systems — Greenhouse, Lever, Workday, Ashby, and 15+ others. Advertised salaries average $3944k/year based on live listings. 28% of roles are remote-friendly. These listings don't come from other job boards — they're pulled from source, so many won't appear on LinkedIn, Indeed, or Glassdoor.
Open Roles
0
Avg Salary
$3944k
Remote-Friendly
28%
Added This Week
47
Sectors Hiring Director Semiconductor Ic Packaging Assembly Engineerings
Director, Packaging Engineering
The Farmer's Dog
New York, New York, United States Onsite Director Direct
Director, Process Engineering & Packaging
Astrazeneca Biologics
United Kingdom Hybrid Director Direct
Director, Semiconductor IC Packaging & Assembly Engineering
Renesas Electronics
Shah Alam, MY Onsite director Direct
Sr. Director, Pricing & Packaging
Smartsheet
United States Director Direct
Internship - Packaging Engineering
Sandisk
Batu Kawan, Pulau Pinang, MY Onsite mid Direct
Director, Pricing and Packaging
Gainsight
United States- Remote Remote Director Direct
Director, Pricing & Packaging
Freshworks
San Mateo, CA, United States Hybrid director Direct
Director, Pricing & Packaging
Freshworks
San Mateo, CA, United States Hybrid director Direct
Assembly
Alto-Shaam
Menomonee Falls, WI, United States Onsite entry Direct
Senior Packaging Engineering Program Manager
Lovevery
Hong Kong Senior Direct
Engineering Director
Alva Energy
Cambridge (Hybrid) Hybrid Director Direct
Semiconductor Assembly Process Development Engineer
Renesas Electronics
Yonezawa, Yamagata, JP Onsite mid Direct
Packaging Designer
Perry Ellis International
New York, New York, United States Hybrid Mid Direct
Director, Pricing & Packaging
Tanium
Emeryville, CA, United States Onsite Director Direct
Associate Director, Technical Operations (Pharmaceutical Packaging)
US Remote Director Direct
Signal Integrity & IC Package Design
Annapurna Labs Ltd.
Haifa, HA, ISR Onsite Entry Direct
Director of Engineering
Partnerize
Tel Aviv District, Israel Flexible Director Direct
Customer Engineering Director
UiPath
Hong Kong Flexible Director Direct
Customer Engineering Director
UiPath
Seoul Flexible Director Direct
Director of Engineering
GiveDirectly
Global Remote Director Direct
Packaging Engineer
Hasbro
United States Direct
Director, Backend Engineering
Galaxy
New York, New York, United States Director Direct
Director, Data Engineering
Hanwha Energy USA
Houston, Texas, United States Director Direct
Packaging executive - TL, IN-packaging
ASSPL
Bengaluru, Karnataka, IND Onsite Mid Direct
Director of Engineering
Renaissance Learning EMEA APAC
Houghton-Le-Spring Hybrid Director Direct
Packaging Executive, ROW Packaging Programs
Amazon Commercial Services
Johannesburg, Gauteng, ZAF Onsite Direct
Assembly Intern
Mercedes-Benz Vans
United States of America-South Carolina-Charleston Onsite Entry Direct
Assembly Technician
Stahls' Hotronix
Carmichaels, Pennsylvania, United States Onsite Entry Direct
Design Director (Branding & Packaging)
Landor
Mumbai, Maharashtra, India Hybrid Director Direct
Director, Engineering
Empower Pharmacy
US Remote Remote Director Direct
Sr. Director, Engineering
Hanwha Energy USA
Houston, Texas, United States Onsite Director Direct
Director Security Engineering
MX Technologies, Inc.
Lehi, Utah, United States Flexible Director Direct
Packaging Executive
Souq. com for E-Commerce LLC
Cairo, EGY Onsite Executive Direct
Product Assembly
National Assemblers
St. Louis, MO Flexible Direct
Supervisor, Packaging Device Assembly (Night Shift)
Resilience
United States of America Onsite Manager Direct
Assembly Technician
ZeroMark
New Jersey, NJ Onsite Direct
Automation Technician (IC)
Jabil
Guadalajara Direct
Director, Software Engineering
Symphony Communication Services
Belfast, Northern Ireland, United Kingdom Onsite Director Direct
Director of Engineering
SEON
Austin Hybrid Director Direct
Associate Director of Engineering
Ossium Health
Indianapolis, Indiana, United States Director Direct
Director of Engineering
Aurelius Systems
San Francisco Onsite Director Direct
Director, Software Engineering
Inovalon
BU: Provider Director Direct
Packaging Associate
ASSPL
Bengaluru, Karnataka, IND Onsite Entry Direct
Lead Technician - Assembly
Commonwealth Fusion Systems
Devens, MA Onsite Lead Direct
Packaging Associate
ASSPL
Bengaluru, Karnataka, IND Onsite Entry Direct
Director Engineering, AI & Data
Deloitte
Amsterdam, NH, Netherlands Onsite mid Direct
Director of Engineering, Infrastructure
Klaviyo
Boston, Massachusetts, United States Flexible Director Direct
Packaging Executive
ASSPL
Bengaluru, Karnataka, IND Onsite Executive Direct
Director of Software Engineering
Renesas Electronics
Hyderabad, IN Onsite director Direct
Senior Director, Platform Engineering
Altana
Boston, MA Director Direct
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Common Questions
- How many Director Semiconductor Ic Packaging Assembly Engineering jobs are available?
- JobsGlitch lists active Director Semiconductor Ic Packaging Assembly Engineering jobs sourced daily from Greenhouse, Lever, Ashby, Workday, and other top ATS platforms.
- What skills are required for Director Semiconductor Ic Packaging Assembly Engineering roles?
- The most in-demand skills for Director Semiconductor Ic Packaging Assembly Engineering roles are Data analysis, Process improvement, Team leadership, Regulatory compliance, Statistical analysis. Requirements vary by seniority and company.
- What is the average salary for a Director Semiconductor Ic Packaging Assembly Engineering?
- The average salary for Director Semiconductor Ic Packaging Assembly Engineering roles on JobsGlitch is approximately $3944k/year. Compensation varies by location, seniority, and company.
- Are there remote Director Semiconductor Ic Packaging Assembly Engineering jobs?
- Yes — 28% of Director Semiconductor Ic Packaging Assembly Engineering jobs on JobsGlitch are remote-friendly. Browse remote Director Semiconductor Ic Packaging Assembly Engineering jobs at jobsglitch.com/jobs/remote/director-semiconductor-ic-packaging-assembly-engineering.