Remote Flip Chip Semiconductor Packaging Design Process And Materials Development Jobs

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Remote Roles

0

Avg Salary

$661k

Added This Week

32

Top Skill

Data analysis

Top Skills

Data analysis 10%Process optimization 8%Process development 6%Scale-up 6%Inventory control 6%Technology Transfer 6%Chip Design 4%RTL design 4%Process design 4%Upstream Process Development 4%Regulatory compliance 4%Packaging development 4%

Materials Process Technician

Tempo

Remote $65k–$95k Direct
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Chip Design Engineer

Annapurna Labs Ltd.

Remote FULL TIME $300k–$450k Direct
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Chip Design Engineer

Annapurna Labs Ltd.

Remote Mid FULL TIME $385k–$595k Direct
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Chip Design Student

Annapurna Labs Ltd.

Remote Entry PART TIME $48k–$72k Direct
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Process/Design Engineer

Amazon UK Services Ltd.

Remote FULL TIME $75k–$110k Direct
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Packaging Designer

Perry Ellis International

Remote Mid FULL TIME $75k–$105k Direct
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Process Design Engineer - Vapor

Zeeco

Remote Mid FULL TIME $95k–$135k Direct
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Principal Scientist, Upstream Process, Process Development

Legend Biotech

Remote Senior FULL TIME $146k–$192k Direct
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Senior Commodity Analyst, Semiconductor and Passives

Remote Senior $1500k–$2500k Direct
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Scientist, LNP Process and Development

Serif Biomedicines, Inc.

Remote Senior $100k–$143k Direct
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Junior QA Engineer (Flip Team)

eMAG

Remote Entry $55k–$75k Direct
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Packaging and Sustainability Manager

Revance

Remote Manager FULL TIME $115k–$165k Direct
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Engineer III, Process Development

Moderna

Remote Senior FULL TIME $90k–$144k Direct
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Sr. Packaging Development Specialist

Monster Energy

Remote Senior $65k–$86k Direct
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BIW Structure Design and Development

Mercedes-Benz Research and Development India

Remote $1500k–$2500k Direct
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Sr. Packaging Development Manager

Monster Energy

Remote Manager $114k–$152k Direct
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Packaging Design Engineer

Signode

Remote not-applicable FULL TIME $115k–$140k Direct
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BIW Structure Design and Development

Mercedes-Benz Research and Development India

Remote FULL TIME $1500k–$2500k Direct
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Director, Pricing and Packaging

Gainsight

Remote Director FULL TIME $75k–$100k Direct
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Process Design Engineer

ALTEN Technology USA

Remote $115k–$155k Direct
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Materials Specialist

Breeze Airways

Remote FULL TIME $0k+ Direct
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Target Fabrication and Materials Characterization Technologist

Lawrence Livermore National Laboratory

Remote entry FULL TIME $85k–$135k Direct
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Target Fabrication and Materials Characterization Technologist

Lawrence Livermore National Laboratory

Remote entry FULL TIME $85k–$135k Direct
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Assoc Packaging Designer

Hasbro

Remote Junior FULL TIME Direct
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Materials Specialist

Wabtec

Remote not-applicable FULL TIME $62k–$85k Direct
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Sr. Business Development Manager, Sustainable Packaging, Robotics Delivery and Packaging Innovation

Amazon EU Sarl

Remote Senior FULL TIME $115k–$175k Direct
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Principal Scientist, Lentivirus Downstream Process Development

Legend Biotech

Remote Senior FULL TIME $146k–$192k Direct
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Sr/Principal Scientist - Upstream Process Development

Genezen

Remote Senior FULL TIME $165k–$235k Direct
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Director, Process Engineering & Packaging

Astrazeneca Biologics

Remote Director FULL TIME $135k–$195k Direct
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Material/Process Inspector

TxDOT

Remote Entry $45k–$71k Direct
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Process Risk and Compliance Operations Manager

Airbnb

Remote Manager FULL TIME $156k–$193k Direct
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System and Process Project Manager

Remote Manager FULL TIME $110k–$120k Direct
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Semiconductor Assembly Process Development Engineer

Renesas Electronics

Remote mid FULL TIME $7500k–$11000k Direct
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Business Development Manager (OMP Software - Packaging and Paper Products)

OMP Careers

Remote Manager $115k–$165k Direct
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Packaging Engineer

Hasbro

Remote FULL TIME $80k–$126k Direct
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Specialist - RPA (Robotic Process Automation) Development

On Location

Remote $85k–$125k Direct
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Materials & Logistics Coordinator

Voyager Technologies, Inc.

Remote FULL TIME $48k–$56k Direct
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Trainer, GSF Learning and development, GSF Learning and development

ASSPL

Remote FULL TIME $750k–$1250k Direct
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Materials & Processes Engineer

Remote $135k–$185k Direct
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Senior Materials and Processes Engineer

ERC

Remote Senior $135k–$185k Direct
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Solutions Architect, Semiconductor and Quantum Fab

Amazon Web Services, Inc.

Remote FULL TIME $151k–$204k Direct
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SoC Chip Architect, Google Cloud, Silicon

Google

Remote $600k–$900k Direct
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Chip CAD DevOps Engineer, Google Cloud

Google

Remote $175k–$260k Direct
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Packaging Technician Lead

Remote Lead $57k–$78k Direct
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Materials Engineer

BETA Technologies

Remote FULL TIME $95k–$135k Direct
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Senior Construction Manager, Design and Construction

Amazon Deutschland Services GmbH

Remote Senior FULL TIME $95k–$135k Direct
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Sr. Physical Design Engineer - Full Chip, Hardware Compute Group

ADCI

Remote Senior FULL TIME $2500k–$4500k Direct
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Packaging executive - TL, IN-packaging

ASSPL

Remote Mid FULL TIME $1500k–$2500k Direct
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Structural Packaging Designer

Everstar

Remote FULL TIME $1200k–$2000k Direct
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Learning and Development Manager

Western Digital

Remote mid FULL TIME $9500k–$14000k Direct
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Common Questions

Are there remote Flip Chip Semiconductor Packaging Design Process And Materials Development jobs available?
Yes — JobsGlitch lists remote Flip Chip Semiconductor Packaging Design Process And Materials Development jobs sourced daily from Greenhouse, Lever, Ashby, and Workday. No signup required to apply.
What skills do remote Flip Chip Semiconductor Packaging Design Process And Materials Development roles require?
Remote Flip Chip Semiconductor Packaging Design Process And Materials Development roles most commonly require Data analysis, Process optimization, Process development, Scale-up, Inventory control.
What is the salary for a remote Flip Chip Semiconductor Packaging Design Process And Materials Development?
The average salary for remote Flip Chip Semiconductor Packaging Design Process And Materials Development roles on JobsGlitch is approximately $661k/year. Remote roles often offer competitive packages independent of location.