Renesas Electronics
Semiconductor
Director,SemiconductorICPackaging&AssemblyEngineering
Neural analysis suggests this role is
optimal for director candidates.
“Director, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics. Skills: Semiconductor IC Packaging, Assembly Engineering, High-volume manufacturing, Yield improvement. Lead sustaining engineering. Drive high-volume manufacturing performance”
Industry & Context.
Data-driven decision-making; Problem-solving; Root-cause analysis
What They're Looking For.
Must Have
Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline, 12+ years of semiconductor manufacturing and packaging engineering experience, 5+ years of leadership experience managing engineering teams in semiconductor manufacturing environments, Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, change management, and qualification methodologies
Nice to Have
Master’s degree or PhD in Engineering or related field, Experience managing geographically distributed engineering teams and global manufacturing operations
What You'll Do.
Lead sustaining engineering
Drive high-volume manufacturing performance
Establish engineering systems
Align assembly engineering roadmaps
Partner with Package Engineering and OSAT teams
Own assembly yield monitoring
Lead data-driven yield improvement initiatives
and customer quality issues
Define KPIs and dashboards
Partner with Quality and Reliability teams
and preventive actions
Ensure process controls and qualification requirements are maintained
and internal quality audits
Work with manufacturing partners to resolve issues
Lead process change management
Assess engineering changes
Lead qualification plans
Maintain disciplined documentation
Serve as key manufacturing engineering interface
Drive manufacturability reviews
Lead manufacturing readiness
and capacity readiness
Coordinate ramp execution
Manage global OSAT and contract manufacturing relationships
Drive partner accountability
Lead technical reviews
Collaborate with suppliers and OSAT partners
Build and develop a high-performing global assembly engineering
Foster a culture of accountability
Support organizational scaling
Drive talent development
Strengthen organizational expertise
How You'll Work.
Team & Collaboration
Cross-functional teams; Package Engineering; R&D; Product Engineering; Quality; Supply Chain; OSAT partners; Global operations
Communication Scope
Communication skills
Process & Methodology
Process change management, NPI to HVM ramp
Full Job Description
We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee yield performance, process stability, quality control, process change management, and manufacturing readiness while partnering closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to successfully transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM). The ideal candidate combines deep semiconductor packaging assembly expertise with strong operational leadership, data-driven decision-making, and cross-functional collaboration skills to drive manufacturing excellence, product quality, and continuous improvement across global operations. This role also serves as a critical interface to Director, Package Engineering by ensuring package development intent, qualification requirements, process windows, and ramp readiness are translated effectively into stable, cost-competitive, high-volume manufacturing execution. Key Responsibilities Manufacturing & Sustaining Engineering Leadership * Lead sustaining engineering across semiconductor package assembly technologies and product lines. * Drive high-volume manufacturing performance in yield, cycle time, quality, throughput, and cost. * Establish strong engineering systems for process control, defect reduction, and continuous improvement. * Align assembly engineering roadmaps with business growth and package technology strategies. * Partner with Package Eng
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