Teledyne Technologies Incorporated
aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research
YieldandIntegrationEngineer
Neural analysis suggests this role is
optimal for Mid candidates.
“Yield and Integration Engineer at Teledyne Technologies Incorporated. Skills: Data analysis, Yield improvement, Failure analysis, Semiconductor wafer processing, Statistical Process Control (SPC), Design of Experiments (DOE/ANOVA). Collects, tracks and analyzes process and metrology data from a variety of sources. Inform and guide team’s design and process yield improvement activities”
What You'll Achieve.
Process yield improvement
Industry & Context.
Structured problem-solving methods; Kepner Tregoe; DMAIC; 8D; 6-sigma
Ability to work in cleanroom environment, Applicants must be either a U. S. citizen, U. S. national, legal permanent resident, asylee, refugee or must be eligible to apply for and obtain the appropriate export control license from the U. S. Departments of State or Commerce.
What They're Looking For.
Must Have
BS in engineering or a science, 2+ years as a Process, Design, Quality or Manufacturing Engineer, Ability to work in cleanroom environment
Nice to Have
M.S. preferred, Semiconductor wafer processing, Programming skills in: Python, Matlab, R, JMP, or similar, SQL database query experience, Statistical Process Control (SPC), Structured problem-solving methods (Kepner Tregoe, DMAIC, 8D, 6-sigma, etc. ), Design of Experiments (DOE/ANOVA), Optical microscopy, SEM/FIB, Profilometry, ellipsometry, X-Section, wafer stress, Other elemental analysis methods (TOF-SIMS, EDX, & Auger), Other fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, & curve trace), Wafer processing (photo, etch, dep, clean, CMP, inspection, etc. ), Vacuum technology and equipment, Infrared Imaging, Hermetic packaging (solder, seam seal, wirebond, WLP, die attach, leak testing, etc. )
What You'll Do.
tracks and analyzes process and metrology data from a variety of sources
Inform and guide team’s design and process yield improvement activities
Direct involvement in device failure analysis
How You'll Work.
Team & Collaboration
Collaborate with team members and other contributors across the spectrum of relevant disciplines and levels of authority; Ability to work effectively in a high performance team environment
Communication Scope
Communications skills
Full Job Description
**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** Under the supervision of the Detector Yield and Data Engineering Manager, collects, tracks and analyzes process and metrology data from a variety of sources to inform and guide team’s design and process yield improvement activities. A significant aspect of this position also includes direct involvement in device failure analysis. Will need to collaborate with team members and other contributors across the spectrum of relevant disciplines and levels of authority. Ability to work effectively in a high performance team environment, including demonstrated strong interpersonal and communications skills. A flexible, self-motivated, results oriented mindset is essential. In support of data mining, analysis and reporting role, ideal candidate will have some experience in: * Semiconductor wafer processing * Programming skills in: Python, Matlab, R, JMP, or similar * SQL database query experience * Statistical Process Control (SPC) * In support of Failure Analysis and yield improvement, ideal candidate will have some experience in: * Structured problem-solving methods (Kepner Tregoe, DMAIC, 8D, 6-sigma, etc.) * Design of Experiments (DOE/ANOVA) * Optical microscopy * SEM/FIB * Profilometry, ellipsometry, X-Section, wafer stress * Other elemental analysis methods (TOF-SIMS, EDX, & Auger) * Other fault isolation techniques (FIBedit, OBIRCH/TIVA, IR, & curve trace) _Other desired experience/knowledge areas:_ * _Wafer
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