Teledyne Technologies Incorporated
aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research
WaferFabProcessEngineer
Neural analysis suggests this role is
optimal for Entry candidates.
“Wafer Fab Process Engineer at Teledyne Technologies Incorporated. Skills: wafer fab processes, plasma etch, thin film deposition, lithography, wet cleans, process development, SEM, FIB/SEM. engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. design and implement new processes”
What You'll Achieve.
support aggressive technology development goals; enable the technology roadmap; Establish feasibility of new processes; recommend improvements
Industry & Context.
creative problem-solving opportunities are many; Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)
Applicants must be either a U. S. citizen or Perm Resident, work environment is mixed general office and clean room/lab
What They're Looking For.
Must Have
Bachelor's degree or equivalent experience in related technical discipline, Proficient computer skills – Word, Excel & Outlook, Ability to communicate clearly in written and spoken English, Ability to use inspection equipment (microscopes, FIB/SEM, interferometers), semiconductor fabrication equipment, and wet bench chemistry, Direct experience with one or more key wafer fabrication processes, U. S. citizen or Perm Resident
Nice to Have
data analysis skills (fluency in Excel, MatLAB JMP, Python, SQL, or equivalent is helpful), Familiarity and/or desire to learn microelectronic/semiconductor and MEMS fabrication techniques, Wafer processing tools for semiconductor or MEMS fabrication, Infrared detector technology, Statistical Process Control and Design of Experiments familiarity desired, Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)
What You'll Do.
engineering wafer fab processes including plasma etch
and wet cleans for next generation infrared detector designs
design and implement new processes
automate or improve existing ones to support aggressive technology development goals
own different tools and associated modules in the area
characterize wafers and devices using SEM and or FIB/SEM
hands-on wafer fabrication and characterization of pilot lots is required
Innovate new processes to enable the technology roadmap
Design and execute experiments
and communicate results
Own tools and process modules in the area
Establish feasibility of new processes through hands‑on processing of pilot lots on production equipment
Characterize results using quantitative metrology tools
Automate or improve established processes
Document methods and workflows in MES‑ready format
Plan for statistical process control (SPC) practices as appropriate
Evaluate production yield challenges and recommend improvements
How You'll Work.
Team & Collaboration
collaborative engineer; Our culture is collaborative, supportive, and fun.
Communication Scope
Ability to communicate clearly in written and spoken English; document, and communicate results
Process & Methodology
Plan for statistical process control (SPC) practices as appropriate
Full Job Description
**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** **About the job** We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Summary:** As part of the uncooled detector (focal plane array) research and development team, the successful candidate will have responsibility for engineering wafer fab processes including plasma etch, thin film deposition, lithography, and wet cleans for next generation infrared detector designs. Candidate will design and implement new processes and automate or improve existing ones to support aggressive technology development goals. They will also own different tools and associated modules in the area. Candidate will characterize wafers and devices using SEM and or FIB/SEM. As part of process development, hands-on wafer fabrication and characterization of pilot lots is required. This is the right place for a self-directed, goal-oriented, collaborative engineer. The work is varied and challenging where creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. The work environment is mixed general office and clean room/lab. **Primary Duties & Responsibilities:** * Innovate new processes to enable the technology roadmap * Design and execute experiments, analyze data, draw conclusions, document, and communicate results * Own tools and process modules in the area * Establish feasibility of new processes through hands‑on proces
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