Teledyne Technologies Incorporated
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WaferFabEquipmentEngineer
“Wafer Fab Equipment Engineer at Teledyne Technologies Incorporated. Skills: Wafer Fab Equipment Engineering, Equipment reliability, Root-cause analysis, Troubleshooting, Semiconductor fabrication equipment. Ownership, reliability, and continuous improvement of wafer fabrication equipment supporting low‑rate manufacturing of infrared detector devices. Improving OEE (Overall Equipment Effectiveness) for equipment used in plasma etch, thin film deposition, lithography, and wet processing”
What You'll Achieve.
Improve OEE (Overall Equipment Effectiveness); Ensure tools are safe, available, capable, and production‑ready; Drive equipment reliability improvements; Reduce unplanned downtime; Stable execution of production commitments
Industry & Context.
Troubleshooting; Root-cause analysis; Problem-solving skills; Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent)
Cleanroom operations, Safety practices, Controlled manufacturing environments, U. S. Citizen or Permanent Resident
What They're Looking For.
Must Have
Bachelor's degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical discipline, 1–5 years of relevant experience supporting semiconductor, MEMS, or microfabrication equipment, Familiarity with equipment metrics (MTBF, MTTR, OEE), SPC concepts, or structured escalation workflows, Strong written and verbal communication skills in English, Proficient computer skills, including JMP, Microsoft Word, Excel, Strong troubleshooting, root-cause analysis, and problem-solving skills, Ability to work hands-on with semiconductor fabrication equipment, including vacuum systems, RF plasma systems, motion control, and wet processing tools, Experience with one or more key wafer fabrication processes, Familiarity with cleanroom operations, safety practices, and controlled manufacturing environments, Must be a U. S. Citizen or Permanent Resident
Nice to Have
Exposure to infrared detectors, focal plane array, or imaging device fabrication, Experience developing and executing preventive maintenance strategies, Lean Six Sigma or other problem solving/decision making methods (8D, Kepner-Tregoe, or equivalent), Experience using basic inspection and diagnostic tools (e. g. , microscopes, electrical test SEM/FIB exposure a plus)
What You'll Do.
and continuous improvement of wafer fabrication equipment supporting low‑rate manufacturing of infrared detector devices
Improving OEE (Overall Equipment Effectiveness) for equipment used in plasma etch
Ensuring tools are safe
Providing hands‑on technical support for low-rate production
Troubleshoot complex equipment
Optimize preventive maintenance
Support the qualification
and recovery of critical tools
Own data analysis and trends for optimum equipment health
Own and support assigned wafer fabrication tools and associated subsystems used in low-rate production
and resolve equipment issues impacting safety
Drive equipment reliability improvements through root cause analysis and corrective/preventive actions
Support hands-on wafer processing and recovery activities for production lots as needed
and trend equipment performance metrics (OEE
Improve equipment diagnostics
and recovery procedures to reduce unplanned downtime
Document equipment procedures
and workflows in MES‑ready formats
Ensure compliance with safety
How You'll Work.
Team & Collaboration
Liaison between process and maintenance; Works closely with Process Engineering, Maintenance, and Quality teams; Collaborate with Process, Maintenance, Quality, and R &D teams
Communication Scope
Strong written and verbal communication skills in English
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