Teledyne Technologies Incorporated
aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research
WaferBacksideProcessingTechnician
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Wafer Backside Processing Technician at Teledyne Technologies Incorporated. Skills: backside wafer processing, assembly operations, hybridization, wicking, wire bonding. Perform a variety of technical tasks associated with backside wafer processing and assembly operations. Support production and engineering priorities in a cleanroom environment”
What You'll Achieve.
yield optimization
Industry & Context.
Comfortable working in full cleanroom gowning (coveralls, gloves, mask, and eye protection), Ability to stand and walk for extended periods (up to 8–10 hours per shift), Frequent bending, stooping, and reaching to handle wafers and assemblies, Manual dexterity for handling small components and precision tools, Ability to lift and carry items up to 25 lbs, Able to use a microscope
What They're Looking For.
Must Have
1–2 years of experience in semiconductor assembly or wafer processing, Familiarity with cleanroom operations and chemical handling, Ability to read and follow paper and digital travelers, U. S. Citizen, U. S. national, legal permanent resident, asylee, refugee or must be eligible to apply for and obtain the appropriate export control license from the U. S. Departments of State or Commerce
Nice to Have
High School Diploma or technical coursework
What You'll Do.
Perform a variety of technical tasks associated with backside wafer processing and assembly operations
Support production and engineering priorities in a cleanroom environment
Focus on die preparation
and wire bonding processes
Clean and inspect diced die using approved solvents and cleaning methods
Operate hybridization tools and maintain process parameters for yield optimization
Perform wicking operations to ensure proper underfill application
Monitor curing cycles and maintain accurate process logs
Inspect bonds for quality and reliability using microscopes and metrology tools
Maintain detailed records of SPC charts
Follow ISO Class 6 cleanroom protocols and 6S principles
Schedule and coordinate WIP for efficient movement between backside processes
Inspect and disposition nonconforming product
How You'll Work.
Team & Collaboration
teamwork skills
Communication Scope
communication skills
Process & Methodology
Schedule and coordinate WIP for efficient movement between backside processes
Full Job Description
**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** **Job Summary:** This candidate will perform a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes. This position will be a 2nd Shift position with hours Monday's through Friday's from 02:30 PM to 11:00 PM. This position will train for the first 8-12 weeks on the 1st Shift before transitioning to the 2nd shift. **Primary Duties & Responsibilities:** * **Hybridization Support** * Clean and inspect diced die using approved solvents and cleaning methods * As needed operate hybridization tools and maintain process parameters for yield optimization * **Wicking & Underfill** * Perform wicking operations to ensure proper underfill application * Monitor curing cycles and maintain accurate process logs * **Wire bonding** * Prepare substrates, load programs, perform wire bonding * Inspect bonds for quality and reliability using microscopes and metrology tools * **General Responsibilities** * Maintain detailed records of SPC charts, tool usage, and consumables * Follow ISO Class 6 cleanroom protocols and 6S principles * Schedule and coordinate WIP for efficient movement between backside processes * Inspect and disposition nonconforming product **Job Qualifications:** * High School Diploma or equivalent; technica
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