Etched

semiconductor

Thermo-MechCFDSimulationIntern-Summer2027

San Jose, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Entry candidates.

The Brief

“Thermo-Mech CFD Simulation Intern - Summer 2027 at Etched. Skills: Thermo-Mechanical CFD Simulation, FEA, CFD, ANSYS Mechanical APDL, ANSYS FLUENT, CoWoS package development. Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL. Perform thermo-mechanical stress/strain analysis and thermal cycling simulations”

Industry & Context.

semiconductor
Problems you'll solve

Thermo-Mechanical analysis; CFD analysis; stress/strain analysis; thermal cycling simulations; package warpage analysis; solder joint reliability analysis; interconnect stress analysis; solder reflow modeling

Eligibility Requirements

Based at our office in San Jose, CA, fully in-person team

What They're Looking For.

Must Have

Pursuing a degree in Mechanical Engineering or related field, Academic or project experience with FEA/CFD tools and analysis, Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT, Understanding of semiconductor packaging materials and processes, grasp on non-linear properties of materials (elastic-plastic, viscoelastic), Basic programming/scripting skills (APDL, Python, MATLAB)

Nice to Have

Familiarity with CoWoS-S/L/R, TSVs, or 2. 5D/3D integration concepts, Knowledge of solder joint reliability and failure analysis, Familiarity with JEDEC standards and reliability testing, Previous internship in semiconductor industry

What You'll Do.

Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL

Perform thermo-mechanical stress/strain analysis and thermal cycling simulations

Analyze package warpage

solder joint reliability

and interconnect stress

Develop CFD models using ANSYS FLUENT for solder reflow modeling

How You'll Work.

Team & Collaboration

Collaborate with design engineering teams on package development

Full Job Description

About Etched Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems. Key responsibilities - Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL - Perform thermo-mechanical stress/strain analysis and thermal cycling simulations - Analyze package warpage, solder joint reliability, and interconnect stress - Develop CFD models using ANSYS FLUENT for solder reflow modeling - Collaborate with design engineering teams on package development You may be a good fit if you have - Education & Experience - Pursuing a degree in Mechanical Engineering or related field - Academic or project experience with FEA/CFD tools and analysis - Technical Skills - Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT - Understanding of semiconductor packaging materials and processes - Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic) - Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts - Basic programming/scripting skills (APDL, Python, MATLAB) Strong candidates may have some experience with - Knowledge of solder joint reliability and failure analysis - Fa

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