Etched
AI inference system
Thermo-MechCFDSimulationIntern-Spring2027
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“Thermo-Mech CFD Simulation Intern - Spring 2027 at Etched. Skills: Thermo-Mechanical CFD Simulation, FEA, CFD, ANSYS Mechanical APDL, ANSYS FLUENT, CoWoS package development. Perform critical thermo-mechanical/CFD analysis. Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL”
Industry & Context.
Perform critical thermo-mechanical/CFD analysis; Analyze package warpage, solder joint reliability, and interconnect stress
12-week paid internship, Generous housing support for those relocating, Daily lunch and dinner in our office, Based at our office in San Jose, CA, fully in-person team
What They're Looking For.
Must Have
Pursuing a degree in Mechanical Engineering or related field, Academic or project experience with FEA/CFD tools and analysis, Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT, Understanding of semiconductor packaging materials and processes, grasp on non-linear properties of materials (elastic-plastic, viscoelastic), Familiarity with CoWoS-S/L/R, TSVs, or 2. 5D/3D integration concepts, Basic programming/scripting skills (APDL, Python, MATLAB)
Nice to Have
Knowledge of solder joint reliability and failure analysis, Familiarity with JEDEC standards and reliability testing, Previous internship in semiconductor industry
What You'll Do.
Perform critical thermo-mechanical/CFD analysis
Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL
Perform thermo-mechanical stress/strain analysis and thermal cycling simulations
Analyze package warpage
solder joint reliability
and interconnect stress
Develop CFD models using ANSYS FLUENT for solder reflow modeling
How You'll Work.
Team & Collaboration
Collaborate with design engineering teams on package development
Full Job Description
About Etched Etched is building the world’s first AI inference system purpose-built for transformers - delivering over 10x higher performance and dramatically lower cost and latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep & parallel chain-of-thought reasoning agents. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team. You'll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next-generation high-performance computing systems. Key responsibilities - Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL - Perform thermo-mechanical stress/strain analysis and thermal cycling simulations - Analyze package warpage, solder joint reliability, and interconnect stress - Develop CFD models using ANSYS FLUENT for solder reflow modeling - Collaborate with design engineering teams on package development You may be a good fit if you have - Education & Experience - Pursuing a degree in Mechanical Engineering or related field - Academic or project experience with FEA/CFD tools and analysis - Technical Skills - Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT - Understanding of semiconductor packaging materials and processes - Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic) - Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts - Basic programming/scripting skills (APDL, Python, MATLAB) Strong candidates may have some experience with - Knowledge of solder joint reliability and failure analysis - Fa
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