Texas Institute for Electronics
Semiconductor
ThermalMechanicalModelingEngineer
Neural analysis suggests this role is
optimal for Mid candidates.
“Thermal Mechanical Modeling Engineer at Texas Institute for Electronics. Skills: Thermal Mechanical Modeling, Heterogeneous Integration, Multiphysics Simulations, EDA Tools. Execute semiconductor package mechanical and thermal simulations. Perform modeling, extraction, and verification”
Industry & Context.
Must be eligible to work in the United States on a full-time basis for any employer without sponsorship., Uniforms and/or personal protection equipment (furnished), May work in all weather conditions, May work in extreme temperatures, May work around chemical fumes, May work around standard office conditions, May work around biohazards, May work around chemicals, May work around electrical and mechanical hazards, Repetitive use of a keyboard at a workstation, Use of manual dexterity (ex: using a mouse), Climbing of stairs, Climbing of ladders, Lifting and moving 30 pounds, Occasional nights/weekends required, Criminal history background check will be required
What They're Looking For.
Must Have
BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline., 3 or more years of direct, hands-on experience in multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms., expertise with EDA/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio., Proven ability to extract/package-level models (dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows., Hands-on scripting/automation skills (Python, Tcl, SKILL, etc. ) to streamline simulation flows., You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen., Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management., Location. Austin, Texas is required for close collaboration with our engineering teams and partners.
Nice to Have
Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups., Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards., Demonstrated experience creating and validating PDK/ADK simulation collateral spanning thermal, and mechanical domains., Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.
What You'll Do.
Execute semiconductor package mechanical and thermal simulations
Build and validate ADK/PDK models
Run end-to-end simulation workflows
Collaborate with EDA vendors
Stay current with next-gen interface standards
Guide technical strategy for SI/PI flows
Mentor junior engineers
Represent TIE in working groups
customer design reviews
How You'll Work.
Team & Collaboration
Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc. ), OSATs, and foundries; Collaborate with product teams; Collaborate with engineering teams and partners
Full Job Description
**Job Posting Title:** Thermal Mechanical Modeling Engineer, Texas Institute for Electronics **\----** **Hiring Department:** Texas Institute for Electronics **\----** **Position Open To:** All Applicants **\----** **Weekly Scheduled Hours:** 40 **\----** **FLSA Status:** To Be Determined at Offer **\----** **Earliest Start Date:** Ongoing **\----** **Position Duration:** Expected to Continue **\----** **Location:** AUSTIN, TX **\----** **Job Details:** ## **General Notes** **About Us** The [Texas Institute for Electronics (TIE)](https://www.txie.org/) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth. Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing. With over $1 billion in funding from the US DoD and the state of Texas, we’re at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named “America’s Coolest City” by Expedia and “The Best Place to Live in the U.S.” by U.S. News and World Report — the Texas Institute for Electronics embodies the city’s innovative spirit. UT Austin, recognized by Forbes as one of [America’s Best Large Employers](https://www.forbes.com/colleges/university-of-texas-at-austin/?sh=79284d054eb6), provides outstanding [employee benefits](https://hr.utexas.ed
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