Micron Technology
Semiconductor
TEMEngineer
Neural analysis suggests this role is
optimal for Mid+ candidates.
“TEM Engineer at Micron Technology. Skills: TEM analysis, FIB/TEM automation, Data science. Perform daily FIB lamella preparation. Perform TEM analysis”
What You'll Achieve.
Improve yield; Enhance efficiency
Industry & Context.
Problem solving; Simplify complex technical problems
What They're Looking For.
Must Have
Ph. D. degree in Materials Science & Engineering, Physics, or a semiconductor-related fields, analytical TEM expertise, atomic‑resolution STEM, EELS, 4D‑STEM, Hands‑on experience in FIB sample preparation, data science skills applied to TEM workflows, data processing, automation, modeling, machine‑learning–based analysis, proficient programming skills using GMS scripts, proficient programming skills using Python, A teamwork mindset, collaborative, solution‑oriented approach
Nice to Have
track record demonstrating innovation, track record demonstrating ownership, track record demonstrating a hard‑working attitude, Ability to work independently, Ability to work in teams, Proven ability to simplify complex technical problems, provide clear, actionable direction, communication skills, ability to build effective peer relationships, ability to build effective customer relationships, Demonstrated ability to quickly learn new skills, Demonstrated ability to mentor others, Demonstrated ability to coach others
What You'll Do.
Perform daily FIB lamella preparation
Support activities in Micron TD
Support activities in manufacturing
Give detailed pass down to next shift
Make contributions to optimize lab procedures
Work closely with process development teams
Solve problems in new part/module development
Develop advanced FIB/TEM techniques
Adopt advanced FIB/TEM techniques
Develop solutions to enhance data acquisition efficiency
Develop solutions to enhance data processing efficiency
How You'll Work.
Team & Collaboration
Process development teams; Research groups; Fab engineers
Communication Scope
Technical communication
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Technology and Products Group in Boise, Idaho, has a top-tier TEM lab equipped with the advanced transmission electron microscopes (TEMs) and cutting-edge focused ion beam (FIB) machines. These state-of-the-art instruments are pivotal for imaging and analyzing memory devices, ensuring Micron remains at the forefront of technological innovation. As a DRAM TEM engineer at DTG TEM lab, you will work with Technology Development research groups to develop new processes, new materials and work with Fab engineers to expedite processes for product transfers and improve yield. The successful applicant for this position will be placed at corresponding Engineer level based on previous experience on analytical TEM work, FIB/TEM automation, and education. **Responsibilities will include, but are not limited to:** * Perform daily FIB lamella preparation and TEM analysis, including microstructure and chemical analysis using electron diffraction, EDS and EELS to support the activities in Micron TD and manufacturing * Give detailed pass down to the people in next shift to make smooth shift transition * Make contributions to optimize the existing lab procedures * Work closely with process development teams to solve problems in the new part/module development * Develop/adopt advanced FIB/TEM techniques with emphasis on AI/automation related techniques for the utilization in semiconductor process * Develop/adopt solutions to enhance the efficiency of data acquisition and data processing in TEM **Minimum Qualifications:** * Ph.D. degree in Materials Science & Engineering, Physics, or a semiconductor-related fields. * Strong analytical TEM expertise, including atomic‑resoluti
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