Micron Technology
Semiconductor
TDThinFilmsProcessDevelopmentEngineerDRAM
Neural analysis suggests this role is
optimal for Mid+ candidates.
“TD Thin Films Process Development Engineer DRAM at Micron Technology. Skills: Thin-film deposition, Process development, DRAM devices. Develop thin-film deposition techniques. Incorporate thin-film deposition techniques”
What You'll Achieve.
Deliver robust solutions; Deliver scalable solutions
Industry & Context.
Model-based problem solving; Troubleshooting; Feasibility issues resolution
What They're Looking For.
Must Have
Master's degree or PhD, 2+ years of experience, Thin-film deposition experience, Process troubleshooting experience, ALD, epitaxy, or plasma deposition knowledge, Data-driven methods experience, DOE and SPC experience, Ability to work independently, Communicate technical results clearly
Nice to Have
5+ years experience, Semiconductor thin-film deposition experience, Semiconductor manufacturing experience, AI application experience, Coding application experience, Data science application experience, Automate and improve process development, Deliver results through teamwork, Cross-functional teamwork experience
What You'll Do.
Develop thin-film deposition techniques
Incorporate thin-film deposition techniques
Build High Aspect Ratio Advanced DRAM features
Relate on-wafer performance to hardware
Lead multi-functional initiatives
Ensure projects meet technical requirements
Ensure projects meet program benchmarks
Partner with suppliers
Partner with internal teams
Influence technical roadmaps
Influence strategic roadmaps
Implement development timelines
Communicate status updates to leadership
Engage with technical challenges
Resolve feasibility issues
How You'll Work.
Team & Collaboration
Multi-functional initiatives; Cross-functional teamwork
Communication Scope
Communicate technical results
Process & Methodology
Development timelines
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ### Department Introduction: We are part of Micron’s Advanced DRAM Technology Development organization, where we push the limits of memory technology every day. Our team works at the intersection of materials science, hardware, and manufacturing to bring next-generation DRAM devices to life. ### ### Position Overview: This role is crucial to building the thin-film foundations of advanced DRAM devices. As a Process Development Engineer passionate about dielectric deposition, you will own key processes, influence technical direction, and work hands-on with innovative tools to deliver robust, scalable solutions. ## ## Responsibilities: * Develop and incorporate new thin-film deposition techniques to build High Aspect Ratio Advanced DRAM features. * Relate on-wafer performance to hardware performance to improve film metrics like uniformity, conformity, and electrical quality. * Lead multi-functional initiatives to ensure projects meet technical requirements and program benchmarks. * Partner with suppliers and internal teams to influence technical and strategic project roadmaps. * Implement development timelines and communicate status updates to leadership using model-based problem solving. * Proactively engage with technical challenges to resolve feasibility issues before they impact production. ## ## Minimum Qualifications: * Master’s degree in Physics, Chemistry, Chemical Engineering, Materials Science, or a related field with 2+ years of experience, or a PhD with relevant research. * Hands-on experience with thin-film deposition and process troubleshooting. * Foundational knowledge of ALD, epitaxy, or plasma-based deposition. * Experience using data-driven methods
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