StaffProcessEngineer-ElectroplatingandCMP

At WD, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. At our core, WD is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that—our technology helped people put a man on the moon and capture the first-ever picture of a black hole. We offer an expansive portfolio of technologies, HDDs, and platforms for business, creative professionals, and consumers alike under our Western Digital®, WD®, and WD_BLACK™. We are a key partner to some of the largest and highest-growth organizations in the world. From enabling systems to make cities safer and more connected, to powering the data centers behind many of the world’s biggest companies and hyperscale cloud providers, to meeting the massive and ever-growing data storage needs of the AI era, WD is fueling a brighter, smarter future. Today’s exceptional challenges require your unique skills. Together, we can build the future of data storage. * Manufacturing engineer owner of wet processes (Electroplating and CMP) in magnetic recording head wafer fabrication. * Responsible for statistical process control (SPC) of process, chemistries, and tool parameters (film composition & thickness, deposition / removal rates, pressure, temperature, chemical concentration, pH, etc.). * Responsible for optimizing process performance (ensure uniform deposition or removal of metal/dielectric materials), maintain process margin. * Conduct failure analysis for process/tool deviations that result in defects and affect wafer quality. * Participate in the introduction of new processes/materials into manufacturing and take ownership to maintain these under good control and to achieve maturity. * Participate in the introduction and qualification of new Wet process equipment for capacity improvement or technology advancement. ## Qualifications * Bachelor’s with 0-5+ years or Master’s with 0-