Micron Technology

Semiconductor

StaffProcessEngineer,APTDBonding

$145–215k ~AI est. Boise, Idaho, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Staff Process Engineer, APTD Bonding at Micron Technology. Skills: Process development, Process optimization, Semiconductor packaging. Develop new process formulations. Develop modified process formulations”

What You'll Achieve.

Improve product quality; Improve product reliability

Industry & Context.

Semiconductor
Problems you'll solve

Root-cause analysis; Model-based problem solving

What They're Looking For.

Must Have

BS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, or Physics, 5 years of relevant industry experience, Knowledge of Advanced Package Integration and DRAM, NAND, or other memory products, Experience with design of experiment techniques (DOE), Experience with Statistical Process Control (SPC), Experience with defect analysis, Experience with data analysis, Experience in semiconductor process engineering and packaging, Fundamental understanding of incoming and outgoing process and equipment interactions, Ability to resolve sophisticated issues through root-cause or model-based problem solving, Ability to adjust to shifting responsibilities and needs of the team

Nice to Have

MS or PHD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Experience leading project teams, Providing leadership updates

What You'll Do.

Develop new process formulations

Develop modified process formulations

Define equipment requirements

Define equipment specifications

Review processing techniques

Review processing methods

Identify assembly process related problems

Diagnose assembly process related problems

Resolve assembly process related problems

Coordinate process evaluation initiatives

Coordinate equipment evaluation initiatives

Coordinate material evaluation initiatives

Complete process evaluation initiatives

Complete equipment evaluation initiatives

Complete material evaluation initiatives

Implement changes at process step

Validate new process baseline

Fan out new process baseline

Support site-to-site portability

Audit material suppliers

How You'll Work.

Team & Collaboration

Global R&D collaboration; Supplier collaboration; Manufacturing teams collaboration

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. **Position Overview:** As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. **Responsibilities:** * Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods * Identify, diagnose, and resolve assembly process related problems * Coordinate and complete process, equipment, and material evaluation / optimization initiatives and implement changes at process step * Validate and fan out new process baseline qualified, including new process, tools, and/or materials for new product introduction

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