StaffPackageDesignEngineer

Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, we are leading the charge in advanced packaging and are seeking a talented Staff Package Design Engineer to join our Advanced Silicon Packaging team to design and deliver the next-generation, high-performance packaging solutions that power our world-class product portfolio. In this role, you will be at the intersection of silicon design and system implementation. You will play a critical part in designing and delivering next-generation, high-performance packaging solutions; including 2.5D/3D, chiplet-based, FCBGA, SiP, WLCSP, wire bond, and QFP/QFN packages that power our industry-leading automotive SoCs, industrial IoT microcontrollers, and AI-forward computing platforms. This role demands strong technical depth in package layout execution, a deep understanding of manufacturability, and a collaborative mindset for cross-domain co-design with our global silicon, SI/PI, thermal, and reliability teams. Key Responsibilities * Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA, SiP, WLCSP, and multi-chip modules. * Develop and maintain package CAD databases, ensuring strict accuracy and adherence to design guidelines, DFM (Design for Manufacturing), and DFA (Design for Assembly) to guarantee high manufacturability and high-yield reliability. * Manage the complete design cycle: from schematic creation, netlist import, and footprint assignment to generating manufacturing outputs (Gerbers, drill data, and fabrication/assembly drawings). * Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures. * Collaborate closely with SI/PI, thermal, reliability, and DFT teams to support co-optimization and participate in critical design reviews. * Ensure all designs strictly co