StaffEngineer,APTDDryEtch

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Department Intro:** The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. **Position Overview:** Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. **Responsibilities:** * Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products * Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation * Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding * Perform root‑cause and failure‑mode analysis and partner with equipment vendors to resolve complex process and hardware challenges * Support global process transfer and readiness for high‑volume manufacturing, including occasional international travel **Minimum Qualifications:** * Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science