Micron Technology
Semiconductor
StaffDesignEngineer,HBM
Neural analysis suggests this role is
optimal for Staff candidates.
“Staff Design Engineer, HBM at Micron Technology. Skills: HBM design, Silicon debug, Memory interfaces. Support HBM product design. Support sustaining design maintenance”
Industry & Context.
Root-cause analysis; Silicon debug; Silicon issues; Customer issues; Yield issues; Reliability issues; Performance issues
What They're Looking For.
Must Have
6+ years (BS) or 4+ years (MS) in EE/CE, DRAM/HBM architecture knowledge, High-speed memory interfaces knowledge, Digital design experience, Custom design experience, Verification experience, Silicon debug experience, Post-silicon validation experience, Drive complex technical issues to closure
Nice to Have
HBM/DDR/LPDDR experience, High-speed IO systems experience, System-level debug background, Silicon-to-system correlation background, Timing analysis knowledge, Margin analysis knowledge, Signal integrity knowledge, Power integrity knowledge, DFT/mBIST/test-mode debug experience, Python programming skills, Scripting skills, Communication skills
What You'll Do.
Support HBM product design
Support sustaining design maintenance
Drive root-cause analysis
Drive issue resolution
Execute issue resolution
Improve product quality
Support customer bring-up
Support customer qualification
Support system-level debug
Contribute sustaining learnings
Improve design quality
Improve debug efficiency
Improve verification methodologies
Analyze silicon issues
Resolve silicon issues
Understand specification requirements
Contribute to implementation
Contribute to verification
Contribute to maintenance of design updates
Support silicon release
Support product lifecycle needs
Drive complex issues to closure
How You'll Work.
Team & Collaboration
Cross-functional teams; Global engineering teams; Product teams; Design Engineering; Product Engineering; Process Integration; Packaging; Technology Development; Architecture; System teams
Communication Scope
Communication skills
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry-leading semiconductor companies. As an **HBM Memory Design Engineer – Sustaining (Staff)** , you will work closely with cross-functional teams including Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging, and Technology Development (TD) to **analyze and resolve silicon issues across HBM products**. You will collaborate with architecture to understand new or updated specification requirements and contribute to the **implementation, verification, and maintenance of design updates** , supporting both silicon release and ongoing product lifecycle needs. This role requires strong technical execution and the ability to independently drive complex issues to closure. ## **Responsibilities** * **Design Support:** Work on HBM product design and support sustaining design maintenance (ECOs/spec changes). * **Silicon Debug:** Own end-to-end debug of silicon, system, and customer issues, driving root-cause analysis and resolution. * **Cross-Functional Collaboration:** Work closely with DE, PE, TD, and system teams to execute issue resolution and ensure alignment on priorities. * **Quality & Yield Improvement:** Identify and debug yield, reliability, and performanc
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