Micron Technology
Technology
StaffDesignEngineer/Architect,HBM
Neural analysis suggests this role is
optimal for Senior candidates.
“Staff Design Engineer/Architect, HBM at Micron Technology. Skills: HBM, DDR, System architecture, Logic design. Design HBM/DDR memory controllers. Develop and implement logic designs”
What You'll Achieve.
Deliver high-quality designs; Meet project timelines
Industry & Context.
Problem solving; Root cause analysis; Debugging
What They're Looking For.
Must Have
5+ years experience, Bachelor's degree
Nice to Have
Master's degree, PhD
What You'll Do.
Design HBM/DDR memory controllers
Develop and implement logic designs
Architect system-level solutions
Lead design and verification efforts
Collaborate with cross-functional teams
Drive technical innovation
Mentor junior engineers
Define and execute verification plans
Develop and maintain design documentation
Evaluate new process technologies
Analyze performance metrics
How You'll Work.
Team & Collaboration
Cross-functional teams; Design teams; Verification teams; Product teams; Architecture teams
Communication Scope
Technical presentations; Design reviews; Documentation
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production. This position focuses on architecting, designing, and optimizing high‑speed datapath circuitry for JEDEC and custom HBM solutions. The role defines complex system requirements, ensures subsystem integration, and supports development through silicon bring‑up while resolving design and program support challenges. **Responsibilities** * Architect, design, and optimize logic‑die and core‑die datapath circuitry for next‑generation HBM products. * Determine system specifications, input/output processes, and working parameters for hardware/software compatibility. * Coordinate subsystem design and integration across multi-functional teams. * Identify, analyze, and resolve system or program support deficiencies. * Develop and recommend corrective actions to ensure robust datapath performance. **Minimum Qualifications** * Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 4 years of relevant industry experience. * Experience architecting, designing, or optimizing high‑speed datapath circuitry. * Ability to define and implement complex system requirements, identify issues, analyze root causes, and recommend corrective actions. * Experience determining hardware/software system specifications and I/O processes. * Experience coordinating subsy
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