Sr.TechnicalProgramManager,AmazonPay

Are you excited about building the future of digital lending at massive scale? Do you want to shape a greenfield lending platform that combines technology, compliance, risk, payments, accounting, and customer experience across emerging international markets? The Credit & Lending team at Amazon Pay is building Amazon’s next-generation lending platform to enable seamless credit experiences for millions of customers across Latin America. This is a high-visibility, high-ownership role at the intersection of fintech innovation, large-scale distributed systems, regulatory compliance, and customer obsession. As a Senior TPM, you will lead complex cross-functional programs spanning engineering, product, finance, tax, compliance, risk, legal, operations, and external financial partners. You will help define and drive the roadmap for Amazon’s in-house lending capabilities across LATAM markets, enabling scalable and reusable technology foundations for onboarding, underwriting, servicing, repayments, accounting, and customer support experiences. This role requires someone who thrives in ambiguity, can operate at both strategic and execution depth, and is passionate about solving hard problems in a fast-moving environment. What You’ll Do Lead end-to-end execution of in-housed lending programs across LATAM markets. Drive alignment across engineering, product, finance, tax, compliance, legal, and external partners. Define program strategy, execution plans, milestones, risk mitigation mechanisms, and operational readiness. Partner with engineering leaders to build scalable, reusable, and resilient lending platform capabilities. Navigate highly ambiguous problem spaces involving regulatory and financial compliance requirements. Influence senior leadership through data-driven decision making, trade-off analysis, and clear communication. Drive launch readiness for critical customer-facing experiences across onboarding, usage, servicing, and repayments. Establish operational excellence