SrSystemDesignEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The core mission of this position is to fundamentally understand HBM cube behavior and failure modes through meticulous bench testing, structured experimentation, and data-driven analysis. The engineer will generate high-quality characterization data, connect observations across domains, and translate insights into actionable structural, technical, packaging, test, and product solutions. This role is key to achieving DTPCO objectives by building a first-principles understanding of the HBM cube's limitations. It involves validating hypotheses with silicon data and supporting modeling, yield improvement, and adaptability of next-generation HBM products. The role plans and performs custom bench-level HBM cube tests involving temperature, mechanical stress, and electrical elements. Tests cover steady-state and transient thermal effects, power/thermal correlation, warpage, stress behavior, IDD, timing margins, parametrics, and fail signatures. **Responsibilities:** * Compose, build, and debug custom bench setups, fixtures, and measurement flows using lab equipment such as power supplies, SMUs, oscilloscopes, thermal hardware, handlers, sockets, and probe cards. * Perform full thermal and mechanical stress characterization using bench stress platforms (e.g., Arora‑type testers) while monitoring electrical behavior under controlled stress. * Conduct hot/cold, transient, and forced‑temperature testing with precision thermal systems (e.g., Sensata‑type chillers or thermal forcing units) to enable power–temperature correlation and failure‑onset analysis. * Develop Python‑, Verilog‑, and C/C++‑based test programs to build targeted stress patterns, segmented workloads, custo