Amazon Kuiper Manufacturing Enterprises LLC
Technology
Sr.RFICDesignEngineer
“Sr. RFIC Design Engineer at Amazon Kuiper Manufacturing Enterprises LLC. Skills: RFIC Design, mm-Wave Circuits, Transceiver Design. Engage with staff to design product solutions. Work with internal team and suppliers”
What You'll Achieve.
Delight future Kuiper customers; Provide best value for Kuiper customers
Industry & Context.
Power/area/performance trade-offs
U. S. citizen or national, U. S. permanent resident, Lawfully admitted into the U. S. as a refugee, Granted asylum
What They're Looking For.
Must Have
Bachelor's degree in Electrical Engineering, 7+ years of experience in mm-Wave/RFIC design, Knowledge of current and upcoming RF standards
Nice to Have
Master's degree or Ph.D. degree, RF transceiver architecture/design for beamforming systems, Experience leading integrated RF transceiver chipsets, Millimeter-wave circuit design and layout, Analog circuit design fundamentals, Mixed-signal design and verification techniques, Hands on experience with RF test equipment
What You'll Do.
Engage with staff to design product solutions
Work with internal team and suppliers
Drive product definition
Drive product execution
Drive product optimization
Define RFIC architecture
Perform extracted simulation
Create power optimized solutions
Create cost optimized solutions
Collaborate with communications systems teams
Collaborate with digital design teams
Collaborate with chip implementation teams
Implement transceivers
Specify RFIC front-end models
Implement RFIC front-end models
Lead implementation of RFIC chips
Work with packaging teams
Ensure seamless system integration
Define analog/digital boundary requirements
Explore architectures for mm-wave circuits
Explore architectures for RF circuits
Make presentations on trade-offs
Design on-chip inductors
Design power combiners
Perform circuit layout
Perform RLC extraction
Run extracted simulation
Specify bench test plans
Specify production test plans
How You'll Work.
Team & Collaboration
Internal inter-disciplinary team; Third party suppliers; Communications systems teams; Digital design teams; Chip implementation teams; Packaging teams; HW teams; EE teams; FW teams
Communication Scope
Detailed presentations
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