Impinj

Technology

Sr.ProcessIntegrationEngineer

$145–210k ~AI est. Seattle, Washington, United States
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Sr. Process Integration Engineer at Impinj”

Industry & Context.

Technology
Problems you'll solve

Root cause analysis

Eligibility Requirements

Occasional international travel

What They're Looking For.

Must Have

Bachelor's degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or related field, Minimum of 5 years of related experience, Demonstrated experience with semiconductor process flows, Applied knowledge of material science and device physics, Hands-on experience conducting failure analysis, Ability to produce clear technical documentation, Ability to present findings to engineering and cross-functional teams, Proven experience designing and executing DOEs, Proficiency in data analysis and automation, Working knowledge of Lean Six Sigma and 8D methodologies

Nice to Have

Experience with WLCSP, Experience with dicing, Experience with advanced packaging technologies

How You'll Work.

Team & Collaboration

Cross-functional teams

Communication Scope

Technical documentation; Present findings

Process & Methodology

DOEs

Full Job Description

Impinj is a leading RAIN RFID provider and Internet of Things pioneer. We’re inventing ways to connect every thing to the Internet — including retail apparel, retail general merchandise, healthcare items, automobile parts, airline baggage, food and much more. With more than 100 billion items connected to date, and multiple Fortune 500 enterprises around the world using our platform, we solve for a better understanding of our world. If it’s a thing, we’re working to connect it. Join Impinj and help us realize our vision of a boundless IoT— connecting trillions of everyday items to the Internet. Team Overview: The Silicon Process Integration team owns the full journey from early-stage process flow development through qualification and into high-volume manufacturing. We develop novel manufacturing technologies tailored to the unique demands of RFID endpoint ICs, working closely with OSAT partners to bring R define experiments and test methods Manage reliability and failure analysis tests to evaluate impact on products What You Will Bring: Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related field with a minimum of 5 years of related experience Demonstrated experience with semiconductor process flows including backend, WLCSP, dicing, and advanced packaging technologies Applied knowledge of material science and device physics as relates to semiconductor failure mechanisms and process development Hands-on experience conducting failure analysis using SEM, TEM, FIB, ion milling, AFM, and related tools to identify root cause and drive corrective actions Ability to produce clear technical documentation and present findings to both engineering and cross-functional teams Proven experience designing and executing DOEs, applying statistical process control, and performing yield analysis to drive process improvements Proficiency in data analysis and automation using one or more of the following: JMP, Minitab, Python, or MATLAB

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