Teledyne Technologies Incorporated

aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research

Sr.ProcessDevelopment&IntegrationEngineer

$114–151k Goleta, California, United States FULL TIME Remote Friendly
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Sr. Process Development & Integration Engineer at Teledyne Technologies Incorporated. Skills: Process Development, Integration, Semiconductor Manufacturing, NPI. Coordinates and directs development and integration of cross module processes and equipment sets. Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test”

What You'll Achieve.

yield improvements; capacity constraints

Industry & Context.

aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research
Problems you'll solve

creative problem-solving; structured problem solving (Kepner Tregoe, DMAIC, 8D, etc.); address process/equipment excursions; capacity constraints; yield improvements

Eligibility Requirements

Ability to work in a cleanroom environment wearing full coverall garments for extended periods, Must be US Citizen or PERM Resident

What They're Looking For.

Must Have

B. S. or equivalent in a science or a related field, Direct experience w/ SQL, Python, JMP, and MATLAB, Min. 2 years of direct semiconductor processing experience, Clear verbal and written communication, working knowledge of semiconductor device physics, infrared detector preferred, Ability to work in a cleanroom environment wearing full coverall garments for extended periods, Must be US Citizen or PERM Resident

Nice to Have

M. S. or PhD preferred, Formal DOE creation, execution, and analysis is a plus

What You'll Do.

Coordinates and directs development and integration of cross module processes and equipment sets

Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test

Defines processing or handling equipment requirements and specifications

Reviews front & backend processing techniques and methods applied in the manufacture

and evaluation of III-V semiconductor sensor devices

Participate in technology advancement for engineering wafer and/or focal plane array fab processes including photolithography

evaporative deposition

thin film coatings and/or anneal

and/or characterization

for the next generation of infrared detector designs

and status production and development experiments

Apply structured problem solving (Kepner Tregoe

etc. ) to address process/equipment excursions

and yield improvements

Engage external vendors to specify

and justify capital processing and metrology equipment

Facilitate gated release into production

How You'll Work.

Team & Collaboration

Present technical findings to key stakeholders; Engage external vendors

Communication Scope

Clear verbal and written communication

Process & Methodology

phase gate release methodologies (NPI, phased LRIP, PFMEA, control plan, or equivalent)

Full Job Description

**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​ We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** **Job Summary:** Under the general supervision of the Process Engineering Manager, coordinates and directs development and integration of cross module processes and equipment sets. Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test. Defines processing or handling equipment requirements and specifications, and reviews front & backend processing techniques and methods applied in the manufacture, fabrication, and evaluation of III-V semiconductor sensor devices. The work is varied, and challenging creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. **Detailed Description:** * Participate in technology advancement for engineering wafer and/or focal plane array fab processes including photolithography, dry and wet etch, passivation, evaporative deposition, thin film coatings and/or anneal, hybridization, thinning, and/or characterization, for the next generation of infrared detector designs. * Design, execute, and status production and development experiments. Present technical findings to key stakeholders. Formal DOE creation, execution, and analysis is a plus. * Apply structured problem solving (Kepner Tregoe, DMAIC, 8D, etc.) to address process/equipment excursions, capacity constraints, and yield improvements. * Hands on familiarity w/ optical microscopy, surface profiling (interfero

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