Teledyne Technologies Incorporated
aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research
Sr.ProcessDevelopment&IntegrationEngineer
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“Sr. Process Development & Integration Engineer at Teledyne Technologies Incorporated. Skills: Process Development, Integration, Semiconductor Manufacturing, NPI. Coordinates and directs development and integration of cross module processes and equipment sets. Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test”
What You'll Achieve.
yield improvements; capacity constraints
Industry & Context.
creative problem-solving; structured problem solving (Kepner Tregoe, DMAIC, 8D, etc.); address process/equipment excursions; capacity constraints; yield improvements
Ability to work in a cleanroom environment wearing full coverall garments for extended periods, Must be US Citizen or PERM Resident
What They're Looking For.
Must Have
B. S. or equivalent in a science or a related field, Direct experience w/ SQL, Python, JMP, and MATLAB, Min. 2 years of direct semiconductor processing experience, Clear verbal and written communication, working knowledge of semiconductor device physics, infrared detector preferred, Ability to work in a cleanroom environment wearing full coverall garments for extended periods, Must be US Citizen or PERM Resident
Nice to Have
M. S. or PhD preferred, Formal DOE creation, execution, and analysis is a plus
What You'll Do.
Coordinates and directs development and integration of cross module processes and equipment sets
Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test
Defines processing or handling equipment requirements and specifications
Reviews front & backend processing techniques and methods applied in the manufacture
and evaluation of III-V semiconductor sensor devices
Participate in technology advancement for engineering wafer and/or focal plane array fab processes including photolithography
evaporative deposition
thin film coatings and/or anneal
and/or characterization
for the next generation of infrared detector designs
and status production and development experiments
Apply structured problem solving (Kepner Tregoe
etc. ) to address process/equipment excursions
and yield improvements
Engage external vendors to specify
and justify capital processing and metrology equipment
Facilitate gated release into production
How You'll Work.
Team & Collaboration
Present technical findings to key stakeholders; Engage external vendors
Communication Scope
Clear verbal and written communication
Process & Methodology
phase gate release methodologies (NPI, phased LRIP, PFMEA, control plan, or equivalent)
Full Job Description
**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** **Job Summary:** Under the general supervision of the Process Engineering Manager, coordinates and directs development and integration of cross module processes and equipment sets. Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test. Defines processing or handling equipment requirements and specifications, and reviews front & backend processing techniques and methods applied in the manufacture, fabrication, and evaluation of III-V semiconductor sensor devices. The work is varied, and challenging creative problem-solving opportunities are many. Our culture is collaborative, supportive, and fun. **Detailed Description:** * Participate in technology advancement for engineering wafer and/or focal plane array fab processes including photolithography, dry and wet etch, passivation, evaporative deposition, thin film coatings and/or anneal, hybridization, thinning, and/or characterization, for the next generation of infrared detector designs. * Design, execute, and status production and development experiments. Present technical findings to key stakeholders. Formal DOE creation, execution, and analysis is a plus. * Apply structured problem solving (Kepner Tregoe, DMAIC, 8D, etc.) to address process/equipment excursions, capacity constraints, and yield improvements. * Hands on familiarity w/ optical microscopy, surface profiling (interfero
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