SrPrcessEngineer工艺工程师

Key Responsibilities - Take on wire bonding (WB) process development for new products and packages (e.g., Cu/Au wire), including establishing process window and bonding conditions independently. - Drive NPI activities covering development validation, data analysis, yield improvement, SPC and reporting. - Perform trouble shooting and drive continuous quality improvement and process stabilization. - Manage new material introduction (e.g., bonding wire, lead frame, substrate, plating solution, capillary) and optimize process parameters to improve productivity and reduce cost. - Define and maintain WB process specifications, standard procedures and support reliability evaluation and risk assessment. - Understand equipment and tooling principles and continuously optimize related specifications and configurations. ## Qualifications - Bachelor’s degree or above in Engineering or related fields. - At least 3 years of experience in semiconductor manufacturing (e.g. QFP, BGA) is preferred. - Experience in process engineering or equipment engineering is a plus. - Familiar with WB process, NPI workflow and data analysis. - Proficient in MS Office (Excel, PowerPoint, Word). - Good communication and teamwork skills. - CET6 and above, working level in English. ## Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design a