Raytheon
SrMechanicalEngineer–ElectronicsPackaging
Neural analysis suggests this role is
optimal for Senior candidates.
“Sr Mechanical Engineer – Electronics Packaging at Raytheon. Skills: Electronics Packaging, Mechanical Engineering, TDP Management. Serve as mechanical engineer. Support documentation”
Industry & Context.
Root cause analyses
Active US security clearance, U.S. citizenship
What They're Looking For.
Must Have
Bachelor's Degree STEM, 5 years mechanical design, 5 years design documentation, Experience with 3D CAD, Experience with GD&T, Experience packaging electronics, Experience environmental testing, Experience hardware performance validation, Experience structural analysis, Experience thermal analysis, Ability to obtain US security clearance, U.S. citizenship required
Nice to Have
Interpersonal skills, Communication skills, Experience mechanical sub-systems packaging, Experience materials, Experience interconnects, Experience large assembly development, Experience managing engineering change processes, Proficient in Creo, Proficient in Windchill, Understanding DFM principles, Understanding DFP principles, Active DoD security clearance, Experience aerospace and defense industry, Advanced degree in Engineering
What You'll Do.
Serve as mechanical engineer
Support documentation
Support mechanical aspects
Support environmental aspects
Support structural aspects
Support thermal aspects
Oversee TDP configuration changes
Manage TDP configuration changes
Analyze producibility updates
Incorporate producibility updates
Support failure investigations
Conduct root cause analyses
Implement corrective actions
Provide technical guidance
Lead cost-saving efforts
Collaborate with cross-functional teams
Resolve engineering challenges
Ensure seamless integration
Provide oversight hardware performance
Review hardware performance
Process engineering change requests
How You'll Work.
Team & Collaboration
Cross-functional teams; Mechanical technical team; Small team mechanical engineers
Communication Scope
Verbal communication; Written communication
Process & Methodology
Engineering change processes
Full Job Description
**Date Posted:** 2026-06-01 **Country:** United States of America **Location:** US-AZ-TUCSON-M10 ~ 3360 E Hemisphere Loop ~ BLDG M10 **Position Role Type:** Onsite **U.S. Citizen, U.S. Person, or Immigration Status Requirements: ** Active and transferable U.S. government issued security clearance is required prior to start date. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance **Security Clearance Type:** DoD Clearance: Secret **Security Clearance Status:** Ability to obtain INTERIM U.S. government issued security clearance is required prior to start date At **Raytheon** , the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. The Mechanical Engineering group in the Shipboard Effectors Department seeking an experienced Mechanical Engineer REA (Responsible Engineering Authority) to contribute to the mechanical technical team for a common Guidance Unit (Stack). This role is primarily responsible for maintaining mechanical Technical Data Package (TDP) configuration changes, driving producibility updates, supporting failure investigations, supporting alternate component and material evaluations and testing, providing support across the full spectrum of mechanical, environmental, structural, and thermal engineering disciplines. Additionally, the mechanical engineer will be part of a small team of mechanical engineers, ensuring successful support of both production and development efforts. This is an onsite role and located in Tucson, Az. **What You Will Do** * Serve as the mechanical engineer to support documentation, mechanical, environmental, structural, and thermal aspects of different
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