Micron Technology

Technology

SrLayoutEngineer-DPGLPDDR

₹23–35L ~AI est. Hyderabad, India FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Sr Layout Engineer-DPG LPDDR at Micron Technology. Skills: Physical design, Timing closure, Process technology nodes. Perform physical design implementation. Conduct block-level timing analysis”

Industry & Context.

Technology
Problems you'll solve

Debug violations; Resolve violations; Debug issues; Analyze issues

What They're Looking For.

Must Have

4+ years physical design implementation, Block-level timing analysis, Advanced process technology nodes, Physical verification and signoff closure, Power integrity analysis, Digital design fundamentals, Automation and scripting

Nice to Have

AI-assisted tools exposure

What You'll Do.

Perform physical design implementation

Conduct block-level timing analysis

Perform setup/hold closure

Work on advanced process technology nodes

Use place-and-route tools

Perform ECO implementation

Perform physical verification

Perform signoff closure

Debug and resolve violations

Analyze power integrity

Mitigate power issues

Collaborate with RTL teams

Collaborate with architecture teams

Use automation and scripting

Improve development efficiency

Improve turnaround time

Use AI-assisted tools

Contribute to skill development

Share effective approaches

How You'll Work.

Team & Collaboration

STA and signoff teams; Power teams; Signoff teams; Technology teams; RTL teams; Architecture teams

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Job Requirements** * 4+ years of hands-on experience in physical design implementation for complex SoC or large-scale digital blocks, with demonstrated ownership from initial floor planning through tape-out. * Strong experience in block-level timing analysis and closure, including setup/hold closure across multi-mode, multi-corner (MMMC) scenarios, in collaboration with STA and signoff teams. * Shown experience working on advanced process technology nodes (e.g., 5nm, 3nm, or equivalent), with awareness of node-specific physical design challenges and constraints. * Proficiency with industry-standard place-and-route tools such as Cadence Innovus and/or Synopsys IC Compiler II, including ECO implementation and design optimization. * Hands-on expertise in physical verification and signoff closure, including DRC, LVS, antenna, and related foundry checks, with the ability to efficiently debug and resolve violations. * Strong understanding of power integrity and reliability analysis, including IR drop, electro-migration (EM), noise, coupling, and crosstalk, along with effective mitigation strategies. * Demonstrated ability to analyze and close IR/EM issues at the block level, working closely with power, signoff, and technology teams based on feedback and analysis results. * Solid foundation in digital design fundamentals, including digital electronics, microprocessors, and computer architecture, enabling effective collaboration with RTL and architecture teams. * Experience in bringing to bear automation and scripting (e.g., Tcl, Python, or equivalent) to improve physical development efficiency, quality, and turnaround time. * Exposure to AI-assisted tools and workflow

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