Micron Technology
Technology
SrLayoutEngineer-DPGLPDDR
Neural analysis suggests this role is
optimal for Senior candidates.
“Sr Layout Engineer-DPG LPDDR at Micron Technology. Skills: Physical design, Timing closure, Process technology nodes. Perform physical design implementation. Conduct block-level timing analysis”
Industry & Context.
Debug violations; Resolve violations; Debug issues; Analyze issues
What They're Looking For.
Must Have
4+ years physical design implementation, Block-level timing analysis, Advanced process technology nodes, Physical verification and signoff closure, Power integrity analysis, Digital design fundamentals, Automation and scripting
Nice to Have
AI-assisted tools exposure
What You'll Do.
Perform physical design implementation
Conduct block-level timing analysis
Perform setup/hold closure
Work on advanced process technology nodes
Use place-and-route tools
Perform ECO implementation
Perform physical verification
Perform signoff closure
Debug and resolve violations
Analyze power integrity
Mitigate power issues
Collaborate with RTL teams
Collaborate with architecture teams
Use automation and scripting
Improve development efficiency
Improve turnaround time
Use AI-assisted tools
Contribute to skill development
Share effective approaches
How You'll Work.
Team & Collaboration
STA and signoff teams; Power teams; Signoff teams; Technology teams; RTL teams; Architecture teams
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Job Requirements** * 4+ years of hands-on experience in physical design implementation for complex SoC or large-scale digital blocks, with demonstrated ownership from initial floor planning through tape-out. * Strong experience in block-level timing analysis and closure, including setup/hold closure across multi-mode, multi-corner (MMMC) scenarios, in collaboration with STA and signoff teams. * Shown experience working on advanced process technology nodes (e.g., 5nm, 3nm, or equivalent), with awareness of node-specific physical design challenges and constraints. * Proficiency with industry-standard place-and-route tools such as Cadence Innovus and/or Synopsys IC Compiler II, including ECO implementation and design optimization. * Hands-on expertise in physical verification and signoff closure, including DRC, LVS, antenna, and related foundry checks, with the ability to efficiently debug and resolve violations. * Strong understanding of power integrity and reliability analysis, including IR drop, electro-migration (EM), noise, coupling, and crosstalk, along with effective mitigation strategies. * Demonstrated ability to analyze and close IR/EM issues at the block level, working closely with power, signoff, and technology teams based on feedback and analysis results. * Solid foundation in digital design fundamentals, including digital electronics, microprocessors, and computer architecture, enabling effective collaboration with RTL and architecture teams. * Experience in bringing to bear automation and scripting (e.g., Tcl, Python, or equivalent) to improve physical development efficiency, quality, and turnaround time. * Exposure to AI-assisted tools and workflow
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