Sr.HardwareFAEngineer,FQSE

Do you enjoy solving complex problems and driving change? Do you thrive in a fast-paced environment? Our team of Failure Analysis Engineers at Ring is tasked with solving systemic hardware issues and building tools to detect and mitigate any future recurrences. We work closely with development engineers and vendors to get to the root cause and drive changes back into our products. We are also responsible for driving changes back into development processes and behavior specifications. As a member of the Ring Failure Analysis team, your primary responsibilities include root cause failure analysis of electronic, mechanical, and/or electromechanical components including assemblies. You will work with other subject matter experts in video, motion sensing, power, and communication technologies to help improve products. We are seeking candidates with practical knowledge of failure mechanisms related to Materials, Mechanical Systems, and/or Batteries as well as using the appropriate analytical tools including optical microscopes, real-time x-ray, scanning electron microscopes, chemical analysis equipment, and other testing and analysis tools. Good interpersonal skills and oral and written communication skills are essential. You will be required to multi-task and prioritize work to meet schedule and cost needs. RESPONSIBILITIES - Responsible for identifying and researching failures down to component level to improve product yield, quality, and reliability. - Perform in-depth chemical, physical, or electromechanical failure analysis. - Perform PCBA debugging on RMA return, determine the root cause of failure, analyze failure reports, and recommend corrective action to prevent reoccurrence of problems. - Work with functional teams as needed to understand device issues. - Articulate conclusions to the team and advocate for appropriate action. - Develop new diagnostic tools or tests and more efficient FA techniques. - Read schematics and layouts and apply failure analysis proced