Micron Technology

Semiconductor

SrEngineer,AdvDRAMPI

$145–215k ~AI est. Boise, Idaho, United States FULL TIME Remote Friendly
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Sr Engineer, Adv DRAM PI at Micron Technology. Skills: Layered memory devices, Device architecture, Process optimization. Lead technology integration activities. Develop new device architectures”

What You'll Achieve.

Meet product performance requirements; Meet reliability requirements

Industry & Context.

Semiconductor
Problems you'll solve

Failure mechanisms; Yield improvement

What They're Looking For.

Must Have

MS or PhD in Physics, Materials Science, Electrical Engineering, or related technical field, 10+ years industry experience in semiconductor process integration or advanced node development, Functional knowledge of semiconductor device physics, Meticulous experiment design (DOE), Proven experience driving multi-functional technical teams, Proven experience managing complex projects

Nice to Have

Detailed knowledge of mainstream memory technologies, Familiarity with circuit and architecture issues, Experience in technology pathfinding or R&D environments

What You'll Do.

Lead technology integration activities

Develop new device architectures

Integrate new device architectures

Optimize process flows

Implement creative solutions

Build experiments in R&D fab

Complete experiments in R&D fab

Analyze parametric data

Evaluate failure mechanisms

Drive continuous yield improvement

Communicate technical findings

Communicate actionable solutions

How You'll Work.

Team & Collaboration

Multi-functional teams

Communication Scope

Technical findings; Actionable solutions

Process & Methodology

Complex projects

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. You will join a world-class team in our industry-leading R&D facility, focusing on novel solutions for scaling, performance, and power in next-generation layered memory technology. This role bridges the gap between device physics and materials science to define the future of memory technology. This is a place for curiosity, experimentation, and real impact as we build solutions for everything from virtual reality to breakthroughs in artificial intelligence. Responsibilities * Lead technology integration activities to enable brand new layered memory devices, focusing on components like charge storage devices and thin-film transistors (TFTs). * Develop and integrate new device architectures, moving concepts from paper through to silicon productization. * Optimize process flows and implement creative solutions to meet complex product performance and reliability requirements. * Build and complete experiments in the R&D fab by collaborating with multi-functional teams, including build, yield improvement, and probe. * Analyze inline, defect, and parametric data to evaluate failure mechanisms and drive continuous yield improvement. * Communicate complex technical findings and actionable solutions to both technical and non-technical audiences. ### ### Minimum Qualifications * MS or PhD in Physics, Materials Science, Electrical Engineering, or a related technical field. * 10+ years of relevant industry experience in semiconductor process integration or advanced node development. * Strong functional knowledge of semiconductor device physics and meticulous e

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