Micron Technology

Semiconductor

SOCTimingAnalysis(STA)Engineer,HBM

$155–215k ~AI est. Richardson, Texas, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“SOC Timing Analysis (STA) Engineer, HBM at Micron Technology. Skills: Static timing analysis, Timing sign-off, Constraint development, Timing closure. Own chip-level static timing analysis. Own chip-level sign-off”

Industry & Context.

Semiconductor
Problems you'll solve

Debug skills; Root cause analysis

What They're Looking For.

Must Have

10+ years industry experience, Full timing sign-off ownership, Multiple tape-outs, 5 nanometers or below, Synopsys PrimeTime expertise, Cadence Tempus expertise, Advanced timing concepts expertise, Multi-mode multi-corner analysis, On-chip variation techniques, Signal integrity analysis, Crosstalk analysis, Power-aware timing, Develop complex SDC constraints, Full RTL-to-GDS flow experience, Synthesis experience, Placement experience, Clock tree synthesis experience, Routing experience, Physical sign-off experience, Hierarchical static timing analysis, Timing-driven collaboration

Nice to Have

DFT concepts exposure, Scan exposure, MBIST exposure, Built-in redundancy analysis exposure, Built-in repair exposure, Debug exposure, Bachelor's degree, Master's degree, Familiarity with foundry PDKs, Familiarity with Liberty timing models, Familiarity with ECSM noise models, Familiarity with CCS noise models, Familiarity with advanced process variation modeling, Excellent analytical skills, Excellent debug skills, Excellent communication skills, Present timing status clearly, Present timing risks clearly, Present sign-off readiness clearly

What You'll Do.

Own chip-level static timing analysis

Own chip-level sign-off

Cover all timing checks

Develop SDC for clock domains

Develop SDC for reset trees

Develop SDC for HBM interfaces

Develop SDC for MBIST

Develop SDC for configuration logic

Ensure sign-off quality

Ensure reuse across generations

Drive timing closure at block level

Drive timing closure at subsystem level

Drive timing closure at full-chip level

Perform critical path analysis

Perform timing engineering change orders

Collaborate with physical design teams

Perform MMMC timing analysis

Perform setup closure

Perform CDC timing analysis

Lead signal integrity analysis

Lead crosstalk analysis

Identify noise-induced timing violations

Implement mitigation strategies

Conduct DFT timing analysis

Conduct scan chain timing analysis

Conduct ATPG mode constraints

Conduct MBIST timing closure

Conduct JTAG interface timing

Provide early STA feedback

Develop automation scripts

Develop automation flows

Extract timing reports

Report sign-off readiness

Perform post-silicon timing correlation

Analyze silicon measurement data

Identify systematic discrepancies

Feed learnings into timing models

Feed learnings into tool settings

Feed learnings into methodology updates

Engage with EDA tool vendors

Evaluate new features

Drive methodology enhancements

Define STA methodology

Drive STA methodology

Define sign-off standards

Drive sign-off standards

Define timing closure best practices

Drive timing closure best practices

Lead readiness reviews

Lead tape-out sign-off

Mentor junior engineers

Grow junior engineers

Contribute to design documentation

Contribute to timing sign-off reports

Contribute to constraint specifications

Contribute to block-level timing

Collaborate with Physical Design

Collaborate with RTL Design

Collaborate with Verification

Collaborate with Product Engineering

Collaborate with Test teams

Ensure timing requirements are met

How You'll Work.

Team & Collaboration

RTL design teams; Physical design teams; Architecture teams; DFT teams; Verification teams; Product teams; Cross-functional teams

Communication Scope

Present timing status; Present timing risks; Present sign-off readiness

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. You will be part of the Heterogeneous Integration Group (HIG), owning chip-level static timing sign-off for next-generation die. You will work closely with RTL design, physical design, architecture, design for test (DFT), verification, and product teams to ensure timing integrity from initial design through tape-out. This is a hands-on senior technical role focused on chip-level static timing analysis ownership, timing closure, methodology development, and pre- and post-silicon timing correlation. Job Description ### Responsibilities will include, but are not limited to: * Own end-to-end chip-level static timing analysis and sign-off, covering all timing checks including setup, hold, recovery, removal, and data-to-data across all process corners, operating modes, and voltage and temperature conditions. * Develop, maintain, and validate comprehensive Synopsys Design Constraints (SDC) for all clock domains, reset trees, high-bandwidth memory (HBM) physical interfaces, Joint Test Action Group (JTAG), memory built-in self-test (MBIST), design for test (DFT), and configuration logic, ensuring sign-off quality and reuse across design generations. * Drive timing closure at block, subsystem, and full-chip levels through critical path analysis, timing engineering change orders (ECOs), and close collaboration with physical design teams on placement, clock tree synthesis (CTS), and routing to meet timing targets. * Perform multi-mode, multi-corner (MMMC) timing analysis including setup and hold closure, clock domain crossing (CDC) timing, and application of on-chip variation derates (OCV, AOCV, POCV) appropriate for advanced technology nodes. * Lead signal integrity and cro

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