Annapurna Labs
AI Silicon Packaging
Signal&PowerIntegrityEngineer
“Signal & Power Integrity Engineer at Annapurna Labs. Skills: Signal integrity, Power integrity, Package design, Advanced packaging. Perform package-level SI or PI simulations. Support package stack-up design”
What You'll Achieve.
Meet performance targets; Meet power delivery targets; Meet manufacturing targets
Industry & Context.
Root cause analysis
What They're Looking For.
Must Have
BS degree in electrical engineering, 5+ years of experience, Solid understanding of SI or PI, Experience with simulation and SI/PI tools, Understanding of advanced packaging technologies, Familiarity with stack-up design, Good communication skills
Nice to Have
MS with 3+ years experience, Exposure to high-speed serial protocols, Experience correlating SI/PI simulations, Familiarity with equalization techniques, Interest in package co-design, Familiarity with high-density fan-out, Exposure to package-level thermal-aware analysis
What You'll Do.
Perform package-level SI or PI simulations
Support package stack-up design
Assist with dielectric material evaluation
Analyze impedance control
Assist with layer assignment
Assist with RDL routing studies
Run high-speed channel simulations
Analyze package PDN performance
Model advanced interconnects
Build and validate models
Coordinate with SoC die-level teams
Coordinate with board design teams
Support co-optimization of package architecture
Flag potential package manufacturing risks
Propose mitigation approaches
How You'll Work.
Team & Collaboration
Technical discussions; Silicon teams; Package teams; Board teams
Communication Scope
Technical discussions
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