Renesas Electronics

semiconductor

SeniorStaffEngineer(Design)

bayan lepas, penang, malaysia FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for mid candidates.

The Brief

“Senior Staff Engineer (Design) at Renesas Electronics. Skills: Design, Program Management, Semiconductor Packaging. Lead cross-functional teams. Lead COGS reduction programs”

What You'll Achieve.

ensure seamless program execution in NPI projects; Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp; Drive capacity expansion initiatives across global manufacturing sites; support production scalability; ensure alignment with organizational priorities; ensure alignment, clarity, and seamless execution across all stages of the program; support committed customer delivery timelines; ensure cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies; ensure timeline adherence, cost efficiency, and quality standards across programs; Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs

Industry & Context.

semiconductor
Problems you'll solve

problem‑solving; remove roadblocks; implement data‑driven mitigation plans; assessing the business impact of schedule slips and risk scenarios

What They're Looking For.

Must Have

Bachelor’s or Master’s degree in Electrical Engineering, 8+ years of experience in semiconductor packaging technology and product lifecycle management, understanding of semiconductor packaging manufacturing flows, Proven ability to lead complex, cross‑functional programs in ambiguous environments, stakeholder management, communication, collaboration, cross‑functional partnership skills, Highly analytical, organizational, problem‑solving, time‑management, multitasking capabilities, Quick learner, ability to adopt new tools, systems, and processes, Self‑motivated, inquisitive, committed to continuous personal and professional development

Nice to Have

prior work experience at an assembly site as a process or integration engineer

What You'll Do.

Lead cross-functional teams

Lead COGS reduction programs

Drive capacity expansion initiatives

Build and manage detailed schedules

Manage Engineering Build Request prioritization

Drive sample readiness

Coordinate and conduct Project Gate reviews

Provide structured leadership updates

How You'll Work.

Team & Collaboration

cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality; aligning engineering, operations, and supply chain; liaison between the product group, operations/supply chain teams, and key OSAT interface teams; cross-functional teams; cross-functional readiness; cross-functional partnership skills across engineering, operations, supply chain, and OSAT teams

Communication Scope

communication; stakeholder management; clear communication of risks and dependencies; structured leadership updates

Process & Methodology

seamless program execution, impact assessment, qualification, PCN, safelaunch, production ramp, quantifying savings, evaluating ROI, assessing the business impact, schedule slips, risk scenarios, Build and manage detailed schedules for NPI, COGS and capacity, track progress, remove roadblocks, implement data‑driven mitigation plans, Engineering Build Request prioritization, bi‑weekly reviews, alignment with organizational priorities, ensure alignment, clarity, and seamless execution, maintain schedules, committed customer delivery timelines, Project Gate reviews, milestone alignment, clear communication of risks and dependencies, timeline adherence, cost efficiency, quality standards across programs, program status, risks, mitigation plans, accurate schedules, qualification documentation

Full Job Description

Job Description * Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects. * Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios. * Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability. * Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans. * Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities. * Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program. * Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines. * Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies. * Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs. * Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation. ## Qualifications * Bachelor’s or Master’s degree in Electrical Engineering, with 8+ years of experience in semiconductor packaging technology and product lifecycle management. * Strong understanding of semiconductor packaging manufacturing flows – including development and production pr

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