Micron Technology

Semiconductor

SeniorSOCPhysicalDesignEngineer,HBM

$175–250k ~AI est. Richardson, Texas, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Senior SOC Physical Design Engineer, HBM at Micron Technology. Skills: Physical design, SoC integration, HBM, Timing closure. Support physical implementation of SoC blocks. Meet performance, power, area targets”

What You'll Achieve.

Deliver best-in-class PPA; Deliver robust signoff collateral; See work through tapeout; See work through silicon

Industry & Context.

Semiconductor
Problems you'll solve

Debug timing violations; Debug DRC violations; Debug LVS violations; Post-silicon debug

What They're Looking For.

Must Have

Hands-on EDA tools experience, Static timing analysis fundamentals, Clocking concepts, Synopsys Design Constraints (SDC), Power intent methodologies, Unified Power Format (UPF), Common Power Format (CPF), Power grid planning, Physical verification flows, Signoff flows, Design rule checking, Layout versus schematic, Parasitic awareness, Hierarchical physical design, SoC integration methodologies

Nice to Have

HBM or DRAM adjacent SoC designs, Memory-subsystem-heavy SoCs, Signal integrity analysis, Reliability analysis, IR drop analysis, Electromigration analysis, Tcl script development, Python script development

What You'll Do.

Support physical implementation of SoC blocks

Assist with setup and hold timing closure

Collaborate with RTL design teams

Ensure correct clocking

Ensure reset strategies

Ensure power intent implementation

Integrate complex IP blocks

Implement complex IP blocks

Focus on timing correctness

Focus on physical correctness

Run physical signoff checks

Debug physical signoff checks

Address DRC violations

Address LVS violations

Address timing violations

Ensure scan logic is clean

Ensure MBIST logic is clean

Participate in tapeout readiness activities

Perform engineering change order flows

Perform design reviews

Perform post-silicon debug

Correlate silicon behavior

Apply EDA tool experience

Work in cross-functional team

How You'll Work.

Team & Collaboration

Design teams; Verification teams; DFT teams; Packaging teams; Manufacturing teams; RTL design teams; Cross-functional team; Global team

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. You will drive physical implementation of advanced high‑bandwidth memory (HBM) system‑on‑chip (SoC) logic and base die designs from netlist through GDSII within the Heterogeneous Integration Group. You will collaborate closely with design, verification, design for test (DFT), packaging, and manufacturing teams to deliver best‑in‑class performance, power, and area (PPA) with robust signoff collateral. This is a hands‑on role where you can own blocks or top‑level integration across multiple product generations and see your work through tapeout and silicon. Job Description ### Responsibilities will include, but are not limited to: * Support physical implementation of SoC blocks from floorplanning through placement, clock tree synthesis (CTS), routing, and optimization to meet performance, power, and area targets. * Assist with setup and hold timing closure across multi‑mode, multi‑corner (MMMC) scenarios using industry tools such as PrimeTime or Tempus under guidance of senior engineers. * Collaborate with RTL design and integration teams to ensure correct clocking, reset strategies, and power intent implementation throughout the design. * Integrate and implement complex intellectual property (IP) blocks including controllers, interfaces, memory built‑in self‑test (MBIST), design for test (DFT) logic, buffers, and PHY‑adjacent logic with focus on timing and physical correctness. * Run and debug physical signoff checks such as design rule checking (DRC), layout versus schematic (LVS), and timing signoff, addressing violations with support from signoff experts. * Work with DFT teams to ensure scan and MBIST logic are physically clean and do not negatively impact timin

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