One Thing
Technology
SeniorProductEngineer(PkgPEMFG),HeterogeneousIntegrationGroup(HIG),HighBandwidthMemory(HBM)ProductEngineering
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“Senior Product Engineer (Pkg PE MFG), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM) Product Engineering at One Thing. Skills: Product Engineering, Yield Improvement, Failure Analysis. Improve assembly yield. Improve HBM Cube yield”
What You'll Achieve.
Improve Time 0 DPM; Improve Field DPM; Reduce inline fallout; Improve Manufacturing Line Yield; Enhance overall cumulative yield; Enhance quality improvement; Reduce cost; Increase yields; Enhance KPIs
Industry & Context.
Problem solving; Root cause analysis; Debugging
International travel
What They're Looking For.
Must Have
Bachelors/Masters Electrical/Electronic/Mechanical Engineering, 5 years relevant experience, Leadership Skills experience, Technical Skills experience, Problem solving experience, Root cause understanding experience, Solution space experience, In depth circuit analysis experience, Good knowledge of statistics, Good knowledge of data analysis tools, Good knowledge of scripting, Proven track record collaborative work, Sense of responsibility, Accountability towards assigned role, Professional work ethic, Excellent communication skills, Excellent presentation skills, Passionate about people leadership, Drive toward ongoing learning, Drive toward development
Nice to Have
AI/ML model development experience, AI/ML model deployment experience, AI/ML model validation experience
What You'll Do.
Improve assembly yield
Improve HBM Cube yield
Ownership of cumulative yield
Root cause analysis of issues
Resolution of Qual issues
Resolution of RMA issues
Debug packaging issues
Identify root cause failures
Drive resolution through teams
Establish robust Process Conversion Business Process
Facilitate Yield Improvement
Facilitate DPM Improvement
Provide recommendation for new process conversions
Drive changes for technical advantage
Develop project management skills
Make final decisions on risk analysis
Make final decisions on project prioritization
Validate AI/ML models
How You'll Work.
Team & Collaboration
Cross-functional teams; Global team; Within HBM; Outside HBM; Technology Development; Packaging organizations; Cross-functional teams; Fab; HBM Technology Development; HBM Design; System Development; Quality/Reliability teams
Communication Scope
Presentation skills
Process & Methodology
Project management
Full Job Description
**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a member of HIG HBM Package Product Engineering, you will work with a high-performing team to drive for Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. **Key Responsibilities** * **ASM Yield and DPM Improvement:** Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. * **HBM Cube Yield Improvement:** Improving HBM Cube yield through test optimization and coverages by collaboration with Technology Development and Packaging organizations to reduce Manufacturing Line Yield. * **Cumulative Yield Ownership:** Work with cross-functional teams, to lead impactful initiatives that significantly enhance overall cumulative yield and quality improvement, driving substantial benefits for the organization. * **Root Cause and Resolution of Qual and RMA Packaging Issues:** Debug and identify root cause and failures in by electric failure analysis (EFA) and Physical Failure Analysis (PFA) and drive for resolution and impr
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