Analog Devices, Inc.
semiconductor
SeniorProcessIntegrationEngineer
Neural analysis suggests this role is
optimal for Senior candidates.
“Senior Process Integration Engineer at Analog Devices, Inc.. Skills: Process Integration, Semiconductor Manufacturing, Yield Improvement. Optimize manufacturing processes. Transfer manufacturing processes”
What You'll Achieve.
optimize and transfer processes; resolve technical issues; drive advancements in automation and robotics; drive advancements in mobility; drive advancements in healthcare; drive advancements in energy; drive advancements in data centers
Industry & Context.
resolve technical issues; root-cause analysis; failure analysis
10% travel
What They're Looking For.
Must Have
5 + years experience as a semiconductor Process Engineer or Process Integration Engineer, Master’s degree or above in Electrical Engineering, technical foundation in wafer fabrication processes, Photolithography, Chemical Mechanical Polishing (CMP), Diffusion, Chemical Vapor Deposition (CVD), Wet and dry etch, Rapid Thermal Annealing (RTA), Ion implantation, Epitaxial growth, Metallization, Demonstrated knowledge of semiconductor device physics, CMOS and BJT technologies, Working knowledge of statistical process control (SPC), applied statistics, attention to detail, proven root-cause analysis capability, Basic familiarity with failure analysis methodologies
Nice to Have
Experience with foundry tape-out flows, TSMC or similar, Experience with foundry NPI, troubleshooting tape-out and process-transfer issues, Background in IC wafer fabrication engineering, semiconductor materials, manufacturing systems, wafer electrical test
What You'll Do.
Optimize manufacturing processes
Transfer manufacturing processes
Execute tape-out activities
Validate against process flows
Ensure correct layer generation
Identify process changes
Investigate yield issues
Resolve parametric performance issues
Evaluate wafers and lots
Drive Corrective Actions
How You'll Work.
Team & Collaboration
Drive cross-functional teams; Work with cross-functional integration teams; Serve as technical interface; Communicate with executive management; Communicate with key customers; Communicate with auditors
Communication Scope
communication skills; composed, clear, and effective communication
Full Job Description
**About Analog Devices** Analog Devices, Inc. (NASDAQ: [_ADI_](https://finance.yahoo.com/quote/ADI/?ltr=1)) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at [_www.analog.com_](https://www.analog.com/en.html) and on [_LinkedIn_](https://www.linkedin.com/company/analog-devices) and [_X_](https://x.com/ADI_News). We are seeking a highly organized and detail‑oriented **Process Integration Engineer** to support Manufacturing Operations by optimizing and transferring existing 0.18um Mixed Signal and BCD manufacturing processes, driving cross‑functional teams to resolve technical issues, and interfacing with internal and external customers. This role includes ownership of analog/mixed‑signal device processing, parametric testing, and defect analysis for legacy and new technology products. ## **Key Responsibilities** ## **Process Ownership & Technology Transfer** * Provide technical ownership of **BiCMOS and BJT‑focused manufacturing process flows** , including transferring processes from foundry to internal manufacturing site * Execute and support **tape‑out activities** for transferring legacy and new semiconductor products into the Beaverton fab. * Review and interpret **source GDS, mask lists, MT‑form data** , and validate against internal process flows and PDK structures. * Ensure correct **layer generation, scribe selection, die‑size matching, test‑line placement** , and alignment with established flow requirements. * Identify when **new modules, process options, or flow changes** are needed and work with cross‑functional integrat
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