Renesas Electronics

semiconductor

SeniorPowerModuleDesignEngineer

taipei, taiwan, taiwan FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for mid candidates.

The Brief

“Senior Power Module Design Engineer at Renesas Electronics. Skills: Power Module Design, Electrical Design, High-Density Power Modules, DC-DC Converters, High-Frequency Design. end-to-end electrical design of high-density power modules. Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications”

What You'll Achieve.

make every endpoint intelligent; make our lives easier, safe and secure

Industry & Context.

semiconductor
Problems you'll solve

root-cause analysis

What They're Looking For.

Must Have

5+ years of hands-on power electronics design experience, experience designing high-current, high-frequency DC-DC converters, especially multiphase buck architectures, Deep understanding of power stage design and magnetics for high-current applications, Hands-on experience in PCB layout for high-current-density and high-frequency applications, Proven ability to debug complex power circuits through lab measurement and root-cause analysis

Nice to Have

Direct experience designing power modules, VRMs, or highly integrated power solutions is strongly preferred

What You'll Do.

end-to-end electrical design of high-density power modules

high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications

Conduct PDN extraction for the module package to assess power path losses and switch-node ringing

Design inductors per module and silicon pinmap

Build and run module thermal models to ensure all components remain below maximum operating temperatures

Support design-for-manufacturing (DFM) and design-for-test (DFT) activities

How You'll Work.

Team & Collaboration

Collaborate with package engineers and IC designers to develop advanced packaging solutions; Work with the validation team to debug power modules and perform bench characterization; Ability to collaborate effectively across IC design, packaging, reliability, and manufacturing teams

Full Job Description

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world. We are seeking a Senior Power Module Design Engineer to own the end-to-end electrical design of high-density power modules. These products target next-generation GPU and AI accelerator core power delivery with extremely high current density, fast transient response, and tight thermal and reliability margins. This is a hands-on design role with full ownership from architecture definition through module validation. Key Responsibilities * Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications. * Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module. * Conduct PDN extraction for the module package to assess power path losses

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