SeniorPackagingTechnicalEngineer

NVIDIA has continuously reinvented itself. Our invention of the GPU sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. Today, research in artificial intelligence is booming worldwide, which calls for highly scalable and massively parallel computation horsepower that NVIDIA GPUs excel. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work to amplify human creativity and intelligence. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join our diverse team and see how you can make a lasting impact on the world! We are now looking for a Senior Packaging Technical Engineer. NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. **What you’ll be doing:** * Your responsibilities include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process. * We collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers. * Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package! * Communicate effectively with various teams throughout the company **What we need to see:** * BSEE or equivalent experience. * Minimum of 8+ years in board/system design. Experience with package design is preferred. * Good understanding of transmission line theory, power delivery and signal integrity is desired. * Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCE