Sandisk
Semiconductor
SeniorPackagingEngineer
Neural analysis suggests this role is
optimal for mid candidates.
“Senior Packaging Engineer at Sandisk. Skills: Packaging materials, Material characterization, Failure analysis. Drive advancement in packaging materials. Address material-related challenges”
Industry & Context.
Problem-solving skills; Critical thinking skills
What They're Looking For.
Must Have
Master's or PhD in Materials Science, 5+ years semiconductor packaging experience, Solid knowledge in Materials Science, Material characterization background, Material mechanics background, Failure analysis background, Design of experiment background, Understanding of packaging materials system, Familiarity with industry standards, Familiarity with reliability test methods, Experience in cross-functional environments
Nice to Have
Working knowledge in material testing instruments, Working knowledge in material characterization instruments, Understanding of semiconductor packaging processes, Understanding of semiconductor packaging materials, Understanding of semiconductor packaging technology, Understanding of semiconductor packaging trends, Experience in supplier engagement, Sustainability-driven material development experience
What You'll Do.
Drive advancement in packaging materials
Address material-related challenges
Develop solutions for package requirements
Lead evaluation of packaging materials
Lead development of packaging materials
Lead qualification of packaging materials
Ensure compliance with industry standards
Sustain high material quality
Enable reliable manufacturing
Enable high-yield manufacturing
Enable cost-efficient manufacturing
Perform material characterization
Perform design of experiments
Simulate manufacturing processes
Simulate use-condition failure
Analyze thermal performance
Analyze mechanical performance
Analyze environmental performance
Define material requirements
Define material solutions
Collaborate with suppliers
Develop materials with suppliers
Optimize materials with suppliers
Qualify materials with suppliers
How You'll Work.
Team & Collaboration
Cross-functional working environments; Package design teams; Product design teams; Reliability teams; Failure analysis teams; Assembly R&D teams; Process teams; Global team environment
Communication Scope
Oral communication; Written communication
Full Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. ESSENTIAL DUTIES AND RESPONSIBILITIES In this position, you will work in the Material Engineering team within the Packaging R&D organization who owns and deploys best-in-class material engineering solutions to the top-edge product and technology development across advanced semiconductor packaging, flash memory product and host levels. Your essential duties and responsibilities include: * Drive advancement in packaging materials by addressing material-related design and process challenges. Develop solutions to support next-generation package requirements, including smaller form factors, thinner die, higher interconnect density, increased power, and enhanced reliability. * Lead the evaluation, development, and qualification of advanced packaging materials for both product development and high-volume manufacturing. Ensure compliance with industry standards and sustain high material qual
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