SeniorPackageDesignEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Global Design, Simulation, and Substrate team at Micron Technology is a world-class group of engineers developing advanced semiconductor packaging solutions for memory products including DRAM and NAND. The team operates globally, collaborating with internal assembly sites, technology development teams, and external OSAT partners to deliver high-performance, reliable, and manufacturable package designs across Micron's product portfolio! As a Senior Package Design Engineer, you will lead co-design activities that bridge silicon design, package architecture, and product development for advanced DRAM and memory products targeting applications such as Mobile, Automotive, Artificial Intelligence, Edge/Cloud Computing, and Data Center. During the co-design phase, you will partner with silicon design teams, Business Units, customer-facing teams, and package and product architecture teams to define and drive new product concepts from inception through High Volume Manufacturing (HVM). Be part of the team! You will collaborate with global, multi-functional teams — including Package Architecture, Technology Development, simulation, and manufacturing — to deliver scalable, high-performance package solutions that meet electrical, mechanical, thermal, and reliability requirements. ## Responsibilities * Lead co-design activities by partnering with silicon design teams, Business Units, customers, customer-facing teams, and package and product architecture teams to define new product concepts, optimize die floorplans, interconnection schemes, and package architectures from the earliest stages of chip development. * Define and optimize package architectures for DRAM products, i