Texas Institute for Electronics
semiconductor
SeniororPrincipalTechnicalProgramManager
Neural analysis suggests this role is
optimal for Senior candidates.
“Senior or Principal Technical Program Manager at Texas Institute for Electronics. Skills: Technical Program Management, Semiconductor Packaging, Heterogeneous Integration. Lead planning, execution, delivery of cross-disciplinary programs. Develop and manage program scopes, schedules, budgets, risk mitigation plans”
Industry & Context.
Proactive problem-solving; Proactively resolve issues
Occasional/frequent nights/weekends required, Travel up to 30–50% as needed, Resume/CV, 3 work references with their contact, Letter of interest, Criminal history background check
What They're Looking For.
Must Have
BS in Electrical Engineering, Computer Engineering, or a related technical discipline, 8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies), Working knowledge of semiconductor fabrication processes, Working knowledge of electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows, Exceptional communication skills, Startup DNA, Execution mindset
Nice to Have
MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field, Proven program management chops, Experience working directly with subcontractors, vendors, or external partners, Prior experience at a leading semiconductor foundry or packaging house
What You'll Do.
delivery of cross-disciplinary programs
Develop and manage program scopes
risk mitigation plans
Coordinate efforts across R&D
Serve as central liaison between technical teams
Drive metrics-based accountability and communication
Identify dependencies
anticipate bottlenecks
Support generation of technical documentation
Monitor industry trends in advanced packaging
chiplet architectures
How You'll Work.
Team & Collaboration
Orchestrate collaboration across internal teams and external partners; Coordinate efforts across internal R&D, process development, design automation, and partner organizations; Serve as the central liaison between TIE’s technical teams, university researchers, and external stakeholders
Communication Scope
Exceptional communication skills; Simplify the complex; Create clear deliverables; Build trust with technical and business stakeholders; Translating between engineering and market/customer contexts
Process & Methodology
Planning, Execution, Delivery, Scope management, Schedule management, Budget management, Risk mitigation, Metrics-based accountability, Dependency identification, Bottleneck anticipation, Issue resolution, End-to-end ownership of complex programs
Full Job Description
**Job Posting Title:** Senior or Principal Technical Program Manager **\----** **Hiring Department:** Texas Institute for Electronics **\----** **Position Open To:** All Applicants **\----** **Weekly Scheduled Hours:** 40 **\----** **FLSA Status:** To Be Determined at Offer **\----** **Earliest Start Date:** Ongoing **\----** **Position Duration:** Expected to Continue **\----** **Location:** AUSTIN, TX **\----** **Job Details:** ## General Notes _About TIE_ Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. _Our Mission_ A key part of our mission is to advance the state of the art in 3D heterogeneous integration (3DHI), chiplet-based architectures, and multi-component microsystems- catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices. _Our Impact_ Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing. _Our Technology_ TIE’s 3DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact. UT Austin, recognized by Forbes as one of [America’s Best Large Employers](https://www.forbes.com/colleges/university-of-texas-at-austin/?sh=79284d054eb6), provides outstanding [employee benefits](https://hr.utexas.edu/prospective/benefits) and [total rewards](https://hr.utexas.edu/current/services/my-total-rewards) packages that include: *
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