NVIDIA

Telecommunication

SeniorOptoMechanicalFailureAnalysisEngineer

Yokneam, Israel FULL TIME
The Brief

“Senior Opto-Mechanical Failure Analysis Engineer at NVIDIA. Skills: Opto-Mechanical Failure Analysis, Root Cause Analysis, Reliability Engineering. Lead multidisciplinary investigations. Drive debug activities”

Industry & Context.

Telecommunication
Problems you'll solve

root cause analysis; failure analysis; system-level issues; corrective and preventive actions; product design optimization

Eligibility Requirements

clean room environments

What They're Looking For.

Must Have

B. Sc. in Mechanical Engineering or higher, 5+ years of experience in opto-mechanical and electro-mechanical product development, PCB/PCBA design, understanding of failure analysis methodologies, root cause investigation, reliability engineering principles, physics-of-failure analysis, Hands-on experience debugging complex opto-electro-mechanical systems, identifying thermal, mechanical, assembly, manufacturing, and reliability-related failure mechanisms, Experience leading complex technical investigations, DOE execution, 8D methodology, preparation of detailed investigation and failure analysis reports, background in mechanical simulations for components and assemblies, product design, failure analysis activities, Hands-on experience with laboratory and analytical tools, microscopy, X-ray, CT scanning, thermal imaging, strain/stress measurements, optical lab equipment, clean room environments, Knowledge of optical manufacturing processes, inspection methods, optical modules, fiber-optic interconnects, multidisciplinary system integration, understanding of manufacturability, GD&T, CTF dimensioning, statistical tolerance analysis techniques, Self-motivated team player, verbal and written communication skills in both English and Hebrew

Nice to Have

Active involvement in the development of opto-mechanical telecommunication devices, Exposure development of advanced thermal solutions, heat-pipes, vapor chambers, liquid cooling, Experience working in high-volume manufacturing environments, focus on reliability, yield improvement, design for manufacturability (DFM), Experience with mechanical stress simulation tools, Record of working with supply chains, contract manufacturers, leading resources, consultants, component suppliers, contractors, manufacturing partners, 3D CAD Creo

What You'll Do.

Lead multidisciplinary investigations

Drive debug activities

perform hands-on root cause analysis

Join and lead task forces

Work closely with engineering teams

Perform and drive mechanical simulations

Develop failure analysis methodologies

Present technical findings

How You'll Work.

Team & Collaboration

close interaction with HW, NPI, Thermal, Layout, Quality and Supply chain teams; Work closely with Mechanical, Electrical, Signal Integrity, Thermal, Reliability, and Manufacturing Engineering teams; Present technical findings and recommendations to cross-functional engineering and management teams

Communication Scope

verbal and written communication skills in both English and Hebrew

Process & Methodology

leading complex technical investigations, DOE execution, 8D methodology

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