Axiado
Technology
SeniorICPackagingEngineer
Neural analysis suggests this role is
optimal for mid candidates.
“Senior IC Packaging Engineer at Axiado. Skills: IC Packaging, SiP Design, Chiplet Integration, High-speed Interfaces. Provide technical leadership. Provide architectural ownership”
Industry & Context.
What They're Looking For.
Must Have
BSEE or MSEE, 10+ years IC packaging, Flip-Chip BGA expertise, System-in-Package expertise, RDL expertise, Silicon interposer expertise, Chiplet architectures expertise, Electrical design trade-offs, Mechanical design trade-offs, Thermal design trade-offs, Reliability design trade-offs, Advanced packaging materials, Substrate technologies, Design-for-Manufacturing, Yield optimization
Nice to Have
PhD a plus, UCIe expertise a plus, SI/PI expertise preferred, Experience building methodologies from scratch
What You'll Do.
Provide technical leadership
Provide architectural ownership
Define packaging architectures
Drive packaging architectures
Lead technology path finding
Work with substrate suppliers
Work with internal teams
Shape product execution
Shape packaging strategy
Serve as technical authority
Own package architecture
Own technology roadmap
Lead chiplet-based packaging
Perform package design
Perform physical layout
Guide physical layout
Define substrate stack-ups
Define bump/RDL architectures
Define DFM guidelines
Drive SI/PI trade-offs
Drive thermal trade-offs
Drive mechanical trade-offs
Drive reliability trade-offs
Lead external engagement
Influence product roadmap
Influence risk management
Influence investment decisions
Establish scalable design methodologies
Establish best practices
Establish reusable packaging flows
How You'll Work.
Team & Collaboration
Internal cross-functional teams; External OSATs; External foundries; External key suppliers; Design teams; Product teams; Test teams; Operations teams; Reliability teams; Customer teams
Full Job Description
Axiado is building the future of AI powered digital infrastructure. We are a fast-growing, well funded silicon, systems, and solutions company pioneering a new category of semiconductor called the Trusted Control/Compute Unit (TCU) that combines advanced hardware security, AI driven resilience and efficiency, and real-time platform management. Our technology protects the world’s most critical infrastructure—from data centers to next generation cloud and AI platforms—by securing systems at the foundation levels of hardware, independent of host CPUs and operating systems. Founded in 2019 and now over 150 employees are strong, Axiado has evolved into a recognized leader in the convergence of AI, security, and silicon innovation. We partner with and are actively engaged in commercial programs with multiple Tier 1 industry leaders, validating both our technology and our long-term market trajectory. Axiado has also won numerous industry awards for our ground-breaking products and technological innovations, including being named one of Fast Company’s 2025 Top 10 Most Innovative Companies in Security, winning the 2025 Global InfoSec Award for Outstanding AI Security Solution, and being named a finalist for the Global Semiconductor Alliance’s 2025 “Start-Up to Watch” award. At Axiado, developing breakthrough technology takes more than great engineering—it takes a team of exceptional people who collaborate boldly, challenge assumptions, and take pride in building what comes next. We value curiosity, execution, respect, and a shared desire to make a meaningful impact on the security and reliability of the digital world. If you’re driven to innovate, energized by hard problems, and excited to help define the future of secure AI infrastructure, we invite you to apply and join us on this journey. Axiado Corporation is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing start
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