Axiado
Technology
SeniorICPackagingEngineer
“Senior IC Packaging Engineer at Axiado. Skills: IC Packaging, SiP Design, Chiplet Integration, High-Speed Interfaces. Serve as technical authority for IC and SiP. Own package architecture and technology roadmap”
Industry & Context.
Trade-offs analysis
What They're Looking For.
Must Have
10+ years of experience, BSEE or MSEE, Minimum of 10+ years of experience with extensive IC packaging expertise for SoCs, ASICs, or memory products, Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe), Understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimization, Demonstrated ability to operate autonomously, Make high-impact decisions, Execute in a startup environment, Technical leadership of multiple end-to-end packaging programs, Proven experience with high-speed SerDes package development, Experience defining die-to-die and chiplet based RDLump architecture, Direct collaboration with OSATs, foundries, and substrate suppliers, Cross-functional leadership across design, product, test, operations, reliability, and customer teams, Clear understanding of cost, yield, schedule, and risk trade-offs
Nice to Have
PhD a plus, SI/PI expertise preferred, Experience building new packaging methodologies or platforms from scratch
What You'll Do.
Serve as technical authority for IC and SiP
Own package architecture and technology roadmap
Lead chiplet-based packaging strategies
Perform and guide hands-on package design
Guide physical layout
Define substrate stack-ups
Define bump/RDL architectures
Define DFM guidelines
Drive SI/PI trade-offs
Drive thermal trade-offs
Drive mechanical trade-offs
Drive reliability trade-offs
Lead external engagement with OSATs
Lead external engagement with foundries
Lead external engagement with key suppliers
Influence product roadmap
Influence risk management
Influence investment decisions
Establish scalable design methodologies
Establish best practices
Establish reusable packaging flows
How You'll Work.
Team & Collaboration
Internal cross-functional teams; Foundries; OSATs; Substrate suppliers; Product teams; Test teams; Operations teams; Reliability teams; Customer teams
Process & Methodology
Roadmap planning, Product execution, Technology development, Manufacturing readiness
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