NVIDIA

Networking

SeniorICPackagingDesignEngineer

Yokneam, Israel FULL TIME Remote Friendly
The Brief

“Senior IC Packaging Design Engineer at NVIDIA. Skills: IC Packaging design, high-speed Interconnect systems, substrate layout, Cadence APD (Allegro) or SiP tools. implement high speed and PDN design for ASIC packages. Develop symbols, pad stack and perform substrate package routing, placement, stack-up, reference plane, power distribution using Cadence APD (Allegro) or SiP tools”

What You'll Achieve.

delivering and designing state of the art high-speed Interconnect systems

Industry & Context.

Networking

What They're Looking For.

Must Have

5+ years hands-on in Package/PCB Layout and outing including high speed design signal integrity practices, B. Sc. Electrical Engineering or an Electrical Practical Engineer certificate or equivalent experience, Cadence APD (Allegro) or SiP tools, substrate layout of wire bond and flip chip packages

Nice to Have

Knowledge in Ansys (SIwave, HFSS) or Cadence (Sigrity, PowerSI) simulation tools, Familiarity with Skill language (Cadence) and basic parsing abilities (Python/Perl/Shell-scripting)

What You'll Do.

implement high speed and PDN design for ASIC packages

pad stack and perform substrate package routing

power distribution using Cadence APD (Allegro) or SiP tools

Optimize package pin out incorporating system level trade-offs of pins assignment

Develop methodologies to improve layout environment

and schedule considerations

How You'll Work.

Team & Collaboration

collaborate with Technical Package Lead; cooperation with different design teams; In close co-operation with the SI/PI/HW design teams and product teams

Process & Methodology

Planning, leading projects from start to finish

Free ATS check

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