SeniorFAEngineer

* Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR. * Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA). * Perform die extraction for various package types and execute layer-by-layer polishing at the die level. * Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques. * Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions. * Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies. * Demonstrate a strong understanding of semiconductor manufacturing processes. **Job Qualifications** * Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field. * Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus. * Hands-on experience with a broad range of FA sample preparation tools and techniques. * Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies. [More information about NXP in Malaysia...](https://www.nxp.com/company/about-nxp/worldwide-locations/malaysia:MALAYSIA) #LI-633a