Analog Devices, Inc.
semiconductor
SeniorEngineer,SemiPackagingEngineering
Neural analysis suggests this role is
optimal for Senior candidates.
“Senior Engineer, Semi Packaging Engineering at Analog Devices, Inc.. Skills: IC Packaging, Mechanical Stress Simulation, Thermal Simulation. Develop advanced IC packaging solutions. Perform mechanical stress simulations”
Industry & Context.
Perform component or system level mechanical stress and thermal simulations
Eligible for employee referral program, Export licensing review process may apply
What They're Looking For.
Must Have
Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related field, two (2) years of experience as a Packaging Engineer or related occupation, 3D CAD tools (SolidWorks), FEA software ANSYS, semiconductor IC or electronics assembly, IC package design, optimization, and manufacturing, IC package reliability requirements, failure analysis techniques, or assembly process issues, manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE), CAD tools such as Autocad
What You'll Do.
Develop advanced IC packaging solutions
Perform mechanical stress simulations
Perform thermal simulations
Manage projects through development
Document manufacturing process flows
Establish reliability criteria
Develop qualification plan
How You'll Work.
Team & Collaboration
Work with cross-functional team; Communicate complex engineering ideas to global teams
Communication Scope
Communicate complex engineering ideas simply and effectively
Process & Methodology
Manage projects through development
Full Job Description
**About Analog Devices** Analog Devices, Inc. (NASDAQ: _[ADI](http://finance.yahoo.com/q?s=ADI)_ ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at _[www.analog.com](https://www.analog.com/)_ and on _[LinkedIn](https://www.linkedin.com/company/analog-devices/posts/?feedView=all)_ and _[Twitter (X)](https://x.com/adi_news)_. **Employer:** Analog Devices, Inc. **Job Title:** Senior Engineer, Semi Packaging Engineering **Job Requisition:** 1010.1551.2 / R262672 **Job Location:** San Jose, California **Job Type:** Full Time **Rate of Pay:** $132,142 - $164,910 per year [multiple openings] **Duties:** Work with cross-functional team to develop advanced integrated circuit ("IC") packaging solutions that include design, material selections, qualification, and release-to-manufacturing for various product groups. Perform component or system level mechanical stress and thermal simulations. Manage projects through development of design iterations, substrate layout/simulation, assembly of prototype, and qualification. Document manufacturing process flows and control plans for IC packages at company’s external suppliers. Work with quality and reliability groups to establish the reliability criteria and qualification plan for various end applications. Communicate complex engineering ideas to global teams simply and effectively, as rooted in engineering principles. **Requirements:** Must have a Master’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or related
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