ASM

Semiconductor

SeniorEngineer,ProcessEngineering(AdvancedPackaging)

Singapore, Singapore
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Senior Engineer, Process Engineering (Advanced Packaging) at ASM. Skills: Process Engineering, Advanced Packaging, Thin-film Deposition, Semiconductor Manufacturing. Contribute to research, development, optimization of semiconductor processes. Design, execute, analyze experiments”

What You'll Achieve.

enable the chips that power today’s most advanced technologies; transitioning processes from development into customer and manufacturing environments

Industry & Context.

Semiconductor
Problems you'll solve

Solid problem-solving skills; analytical skills; structured approach to research challenges

What They're Looking For.

Must Have

PhD in Chemical Engineering, PhD in Materials Science, PhD in Physics, PhD in Mechanical Engineering, PhD in Electrical Engineering, Hands-on research experience with thin-film deposition processes, experimental background, designing experiments, analyzing complex data sets, Solid problem-solving and analytical skills, structured approach to research challenges, Clear written and verbal communication skills, Curiosity, initiative, motivation to apply academic research in an industrial setting, understanding of electro/mechanical equipment and software systems

Nice to Have

Research experience related to advanced packaging, Research experience related to interconnects, Research experience related to semiconductor manufacturing, Familiarity with statistical methods, Familiarity with DOE tools, Familiarity with data modeling techniques, Experience with materials characterization methods, Exposure to cross-disciplinary research environments, Exposure to collaborative research environments, Interest in long-term growth within semiconductor technology development, Interest in long-term growth within process engineering

What You'll Do.

Contribute to research

optimization of semiconductor processes

Perform materials and process characterization

Analyze experimental data

Document results in technical reports

Document results in internal presentations

Support troubleshooting of process or equipment issues

Participate in technology reviews

Contribute ideas to process improvement

Contribute ideas to innovation initiatives

Learn industry best practices

How You'll Work.

Team & Collaboration

Collaborate with cross-functional teams; Collaborate with R&D; Collaborate with process engineering; Collaborate with applications; Work closely with experienced engineers; Work closely with scientists

Communication Scope

Clear written communication skills; Clear verbal communication skills; explain technical concepts to diverse audiences

Full Job Description

Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job's mission As a Senior Process Engineer in Advanced Packaging, you will bring your PhD research experience into an industrial R&D environment, contributing to the development of semiconductor process technologies used in next-generation devices. Working closely with experienced engineers and scientists, you will translate scientific insight into scalable, manufacturable solutions. Your work will directly support ASM’s mission to enable the chips that power today’s most advanced technologies. What you will be working on Contribute to the research, development, and optimization of semiconductor processes for Advanced Packaging, including thin-film deposition (ALD, PECVD, PVD, ECP) and surface preparation technologies. Design, execute, and analyze experiments using DOE-based approaches, supported by senior technical experts. Perform materials and process characterization to evaluate film quality, reliability, and performance. Analyze experimental data and clearly document results in technical reports and internal presentations. Collaborate with cross-functional teams across R&D, process engineering, and applications. Support troubleshooting of process or equipment issues in laboratory and pilot environments. Participate in technology reviews and contribute ideas to process improvement and

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