Sandisk
Technology
SeniorEngineer,PackagingEngineering(ThermalDesign)
Neural analysis suggests this role is
optimal for mid candidates.
“Senior Engineer, Packaging Engineering (Thermal Design) at Sandisk. Skills: Thermal design, Packaging engineering, CFD modeling. Work on thermal designs. Perform thermal modeling”
Industry & Context.
Analytical analysis; Numerical analysis
What They're Looking For.
Must Have
B. S. in Mechanical Engineering, 5 years relevant industry experience, Solid knowledge in Mechanical design, Proficiency in CAD software, Knowledge of engineering drafting standards, Knowledge of tolerance analysis, Knowledge of plastic injection molding, Knowledge of metal fabrication, Demonstrated work ethic, Prior history working with suppliers, Prior history working with contract manufacturers, Ability to work in a team environment, Ability to interact with others, Ability to release products on schedule
Nice to Have
Mechanical design background, Electronic consumer product design a plus, Prior retail packaging design a plus
What You'll Do.
Work on thermal designs
Perform thermal modeling
Validate flash products PCBA
Meet demands for small form factor packages
How You'll Work.
Team & Collaboration
Work in a team environment; Interact with others
Communication Scope
Oral communication; Written communication
Full Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. ESSENTIAL DUTIES AND RESPONSIBILITIES: * As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. * The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. * The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. ## Qualifications REQUIRED: * B.S. in Mechanical Engineering plus 5 years, of relevant industry experience * Solid knowledge through academic coursework or experience required in Mechanical design * Proficiency in CAD software (e.g. SolidWorks, Autocad) * Knowledge of engineering drafting standards and tolerance analysis * A strong backgrou
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