Sandisk

Computer Hardware

SeniorEngineer,PackagingEngineering(ThermalDesign)

Batu Kawan, Penang, Malaysia FULL TIME
The Brief

“Senior Engineer, Packaging Engineering (Thermal Design) at Sandisk. Skills: Thermal Design, Packaging Engineering, CFD Modeling. Work in Packaging R&D. Perform thermal modeling”

Industry & Context.

Computer Hardware
Problems you'll solve

solutions to meet increased demands

What They're Looking For.

Must Have

Mechanical design, CAD software, engineering drafting standards, tolerance analysis, plastic injection molding, metal fabrication, work ethic, working with outside suppliers, working with contract manufacturers, work in a team environment

Nice to Have

mechanical design with electronic consumer product design, retail packaging design

What You'll Do.

Work in Packaging R&D

Perform thermal modeling

Validate flash products PCBA

Meet demands for small form factor packages

How You'll Work.

Team & Collaboration

interact with others to release products on schedule

Communication Scope

oral and written communication skills

Free ATS check

Applying for this Senior Engineer, Packaging Engineering (Thermal Design) role?

Most applicants get filtered before a human reads their resume. See if yours makes the cut.

How to Apply on SmartRecruiters

  • SmartRecruiters often includes a video screening step — check camera and mic permissions.
  • Link your GitHub or portfolio directly in the profile section for technical roles.
  • Applications may be reviewed by AI scoring before reaching a recruiter — use keywords from the job description.

ANONYMOUS · UNFILTERED

What do employees actually say about Sandisk?

Real rants from real employees. Read before you apply.

Read Company Rants →